PROCEEDINGS VOLUME 4229
INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS AND ASSEMBLY | 27 NOVEMBER - 2 DECEMBER 2000
Microelectronic Yield, Reliability, and Advanced Packaging
Editor(s): Cher Ming Tan, Yeng-Kaung Peng, Mali Mahalingam, Krishnamachar Prasad
Editor Affiliations +
Cher Ming Tan, Yeng-Kaung Peng, Mali Mahalingam, Krishnamachar Prasad