Burn-in strategy based on Weibull failures

Wei-Ting Kary Chien; Charles H. J. Huang

doi:10.1117/12.404872

23 October 2000 Burn-in strategy based on Weibull failures

Wei-Ting Kary Chien, Charles H. J. Huang

Proceedings Volume 4229, Microelectronic Yield, Reliability, and Advanced Packaging; (2000) https://doi.org/10.1117/12.404872
Event: International Symposium on Microelectronics and Assembly, 2000, Singapore, Singapore

Abstract

Burn-in is crucial for ICs, especially for DRAM. To meet the target failure rate after releasing the products to customers, the manufacturers have to burn-in the chips after assembly and FT for a certain period of time to weed-out the weaker parts. It is important to determine the burn-in time and to set-up a re-burn-in strategy to meet required failure rate and to maintain cost-effective at the same time. This paper introduces an innovative approach to achieve these two objectives along with some practical concerns on burn-in at field applications. The proposed methodology can be applied on versatile statistical distributions. In this presentation, the selected failure mechanisms follows Weibull distribution to illustrate our approaches.

Citation Download Citation

Wei-Ting Kary Chien and Charles H. J. Huang "Burn-in strategy based on Weibull failures", Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); https://doi.org/10.1117/12.404872

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