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Rizvi Rahman
at ASML Netherlands BV
SPIE Involvement:
Author
Publications (3)
Proceedings Article | 22 February 2021 Presentation + Paper
Edge placement error wafer mapping and investigation for improvement in advanced DRAM node
Kuan-Ming Chen, Wolfgang Henke, Ji-Hoon Jung, Ewa Kasperkiewicz, Anita Bouma, Rizvi Rahman, Gratiela Isai, Gwang-Gon Kim, Sotirios Tsiachris, Jae-Doug Yoo, Yuna Park, JaeYoung Park, Jonggeun Won, Nang-Lyeom Oh, Hsin-Yu Chen, WeiTai Lin, Chih-Hung Hsieh, Kuo-Feng Pao, Kyoyeon Cho, Abdalmohsen Elmalk, Sudharshanan Raghunathan, Taekwon Jee, Seung-Uk Jeong, Jeongwoo Jae, Sang-Woo Kim, Dongyoung Lee, Jungchan Kim, WonKwang Ma, Sang-Ho Lee, Chan-Ha Park
Proceedings Volume 11611, 116111V (2021) https://doi.org/10.1117/12.2584149
KEYWORDS: Semiconducting wafers, Critical dimension metrology, Overlay metrology, Optical lithography, Metrology, Visualization, Statistical analysis, Lithography, Graphic design, Etching
Proceedings Article | 20 March 2020 Paper
Improving after-etch overlay performance using high-density in-device metrology in DRAM manufacturing
Ik-Hyun Jeong, Seung-Woo Koo, Hyun-Sok Kim, Jung-Il Hwang, Dong-Jin Lee, Min-Shik Kim, Jae-Wuk Ju, Kang-Min Lee, Young-Sik Kim, Cees Lambregts, Rizvi Rahman, Marc Hauptmann, Raheleh Pishkari, Allwyn Boustheen, Kwang-Young Hu, Paul Böcker, Dong-Hak Lee, In-Ho Joo, Kang-San Lee
Proceedings Volume 11325, 113252X (2020) https://doi.org/10.1117/12.2552028
KEYWORDS: Overlay metrology, Etching, Inspection, Semiconducting wafers, Metrology, Feedback loops, Scanners, Spatial frequencies, High volume manufacturing
Proceedings Article | 20 March 2019 Presentation + Paper
Improved wafer alignment model algorithm for better on-product overlay
Ik-Hyun Jeong, Hyun-Sok Kim, Yeong-Oh Kong, Ji-Hyun Song, Jae-Wuk Ju, Young-Sik Kim, Cees Lambregts, Miao Yu, Rizvi Rahman, Leendertjan Karssemeijer, Elliott McNamara, Paul Böcker, Jong-Cheol Choi, Nang-Lyeom Oh, Kang-San Lee, Jin-Seo Lee
Proceedings Volume 10961, 109610A (2019) https://doi.org/10.1117/12.2516259
KEYWORDS: Optical alignment, Semiconducting wafers, Calibration, Data modeling, Overlay metrology, Metrology, Scanners, High volume manufacturing, Lithography, Sensors
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