Dr. Hong Xiao Profile

Dr. Hong Xiao

Sr. E-beam and Processing Expert

SPIE Involvement:

Author | Instructor

Area of Expertise:

Semiconductor manufacturing process technologies , Electron beam defect inspection , Electron beam defect review , Applications of SEM in IC chip manufacturing , IC chip manufacturing technology trends

Dr. Hong Xiao is the Sr. e-beam and processing expert of ASML with expertise in e-beam applications in defect inspection, defect review, and CDU and overlay metrologies of IC chip manufacturing processes. He worked as e-beam technologist of KLA Corp.; technical marketing specialist of Hermes-Microvision, Inc.; and technical manager of Hermes Epitek Corp. He was a Sr. process engineer in Motorola; associate professor of Austin Community College; and Sr. technical instructor of Applied Materials. He received the Ph.D. in physics from the University of Texas at Austin, Dr. Xiao authored and co-authored over 30 journal and conference papers. He has more than 30 patents in US and other countries. He is the author of textbooks, “Introduction to Semiconductor Manufacturing Technology” the 2nd edition published by SPIE Press in Dec. 2012 and “3D IC Devices, Technologies, and Manufacturing” published by SPIE Press in 2016. He is a member of SPIE since 2005 and lifetime member of Chinese American Semiconductor Professional Association.

SPIE Press Book | 29 April 2016

3D IC Devices, Technologies, and Manufacturing

Hong Xiao

KEYWORDS: Photomasks, Etching, Silicon, Oxides, Semiconducting wafers, Metals, Dielectrics, Tin, Manufacturing

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3D IC Devices, Technologies, and Manufacturing

Proceedings Article | 18 April 2013 Paper

Capturing buried defects in metal interconnections with electron beam inspection system

Hong Xiao, Ximan Jiang, David Trease, Mike Van Riet, Shishir Ramprasad, Anadi Bhatia, Pierre Lefebvre, David Bastard, Olivier Moreau, Chris Maher, Paul MacDonald, Cecelia Campochiaro

Proceedings Volume 8681, 86810F (2013) https://doi.org/10.1117/12.2011162

KEYWORDS: Copper, Metals, Scanning electron microscopy, Semiconducting wafers, Monte Carlo methods, Tungsten, Virtual colonoscopy, Transmission electron microscopy, Inspection, Chemical mechanical planarization

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SPIE Press Book | 19 November 2012

Introduction to Semiconductor Manufacturing Technology, Second Edition

Hong Xiao

KEYWORDS: Semiconducting wafers, Etching, Silicon, Oxides, Metals, Dielectrics, Ions, Plasma, Copper, Photoresist materials

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Introduction to Semiconductor Manufacturing Technology, Second Edition

Proceedings Article | 28 April 2011 Paper

High-throughput critical dimensions uniformity (CDU) measurement of two-dimensional (2D) structures using scanning electron microscope (SEM) systems

Jennifer Fullam, Carol Boye, Theodorus Standaert, John Gaudiello, Derek Tomlinson, Hong Xiao, Wei Fang, Xu Zhang, Fei Wang, Long Ma, Yan Zhao, Jack Jau

Proceedings Volume 7971, 79710Y (2011) https://doi.org/10.1117/12.879910

KEYWORDS: Critical dimension metrology, Semiconducting wafers, Scanning electron microscopy, Inspection, Electron microscopes, Defect inspection, Data acquisition, Etching, Field effect transistors

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Proceedings Article | 7 April 2011 Paper

Demonstration of defect free EUV mask for 22nm NAND flash contact layer using electron beam inspection system

Takeya Shimomura, Satoshi Kawashima, Yuichi Inazuki, Tsukasa Abe, Tadahiko Takikawa, Hiroshi Mohri, Naoya Hayashi, Fei Wang, Long Eric Ma, Yan Zhao, Chiyan Kuan, Hong Xiao, Jack Jau

Proceedings Volume 7969, 79691B (2011) https://doi.org/10.1117/12.879565

KEYWORDS: Inspection, Extreme ultraviolet, Photomasks, Extreme ultraviolet lithography, Defect detection, Lithography, Manufacturing, Particles, Electronic components, Opacity

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Proceedings Article | 25 September 2010 Paper

Native pattern defect inspection of EUV mask using advanced electron beam inspection system

Takeya Shimomura, Yuichi Inazuki, Tsukasa Abe, Tadahiko Takikawa, Hiroshi Mohri, Naoya Hayashi, Fei Wang, Long Ma, Yan Zhao, Chiyan Kuan, Hong Xiao, Jack Jau

Proceedings Volume 7823, 78232B (2010) https://doi.org/10.1117/12.868171

KEYWORDS: Inspection, Extreme ultraviolet, Photomasks, Defect inspection, Bridges, Opacity, Defect detection, Scanning electron microscopy, Optical inspection, Extreme ultraviolet lithography

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Proceedings Article | 2 April 2010 Paper

After development inspection defectivity studies of an advanced memory device

Hyung-Seop Kim, Byoung-Ho Lee, Eric Ma, Fei Wang, Yan Zhao, Kenichi Kanai, Hong Xiao, Jack Jau

Proceedings Volume 7638, 76380L (2010) https://doi.org/10.1117/12.848066

KEYWORDS: Inspection, Critical dimension metrology, Reticles, Optical inspection, Semiconducting wafers, Defect inspection, Bridges, Wafer inspection, Finite element methods, Optical lithography

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Proceedings Article | 11 December 2009 Paper

EUV mask pattern inspection with an advanced electron beam inspection system

Takeya Shimomura, Yuichi Inazuki, Abe Tsukasa, Tadahiko Takikawa, Yasutaka Morikawa, Hiroshi Mohri, Naoya Hayashi, Fei Wang, Long Ma, Yan Zhao, Chiyan Kuan, Hong Xiao, Jack Jau

Proceedings Volume 7520, 75201D (2009) https://doi.org/10.1117/12.837025

KEYWORDS: Inspection, Extreme ultraviolet, Photomasks, Scanning electron microscopy, Defect detection, Opacity, Extreme ultraviolet lithography, Bridges, Silicon, Solids

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Proceedings Article | 11 December 2009 Paper

After development inspection (ADI) studies of photo resist defectivity of an advanced memory device

Hyung-Seop Kim, Yong Min Cho, Byoung-Ho Lee, Roland Yeh, Eric Ma, Fei Wang, Yan Zhao, Kenichi Kanai, Hong Xiao, Jack Jau

Proceedings Volume 7520, 75200J (2009) https://doi.org/10.1117/12.837103

KEYWORDS: Inspection, Reticles, Semiconducting wafers, Optical inspection, Bridges, Wafer inspection, Defect inspection, Finite element methods, Scanning electron microscopy, Optical lithography

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Proceedings Article | 30 September 2009 Paper

Study of program defects of 22nm nanoimprint template with an advanced e-beam inspection system

Takaaki Hiraka, Jun Mizuochi, Yuko Nakanishi, Satoshi Yusa, Shiho Sasaki, Masaaki Kurihara, Nobuhito Toyama, Yasutaka Morikawa, Hiroshi Mohri, Naoya Hayashi, Hong Xiao, Chiyan Kuan, Fei Wang, Long Ma, Yan Zhao, Jack Jau

Proceedings Volume 7488, 74880T (2009) https://doi.org/10.1117/12.834581

KEYWORDS: Inspection, Nanoimprint lithography, Photomasks, Quartz, Vestigial sideband modulation, Defect inspection, Image processing, Manufacturing, Electronic components, Beam shaping

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Proceedings Article | 23 September 2009 Paper

Inspection of 32nm imprinted patterns with an advanced e-beam inspection system

Hong Xiao, Long Ma, Fei Wang, Yan Zhao, Jack Jau, Kosta Selinidis, Ecron Thompson, S. V. Sreenivasan, Douglas Resnick

Proceedings Volume 7488, 74881V (2009) https://doi.org/10.1117/12.833419

KEYWORDS: Inspection, Photomasks, Nanoimprint lithography, Electron beam lithography, Semiconducting wafers, Lithography, Defect inspection, Dysprosium, Scanning electron microscopy, Optical lithography

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Proceedings Article | 23 March 2009 Paper

Study of devices leakage of 45nm node with different SRAM layouts using an advanced e-beam inspection systems

Hong Xiao, Long Ma, Yan Zhao, Jack Jau

Proceedings Volume 7272, 72721E (2009) https://doi.org/10.1117/12.813885

KEYWORDS: Inspection, Semiconducting wafers, Etching, Oxides, Transmission electron microscopy, Nickel, Defect inspection, Manufacturing, Field effect transistors, Silicon

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Proceedings Article | 5 April 2007 Paper

Contact leakage and open monitoring with an advanced e-beam inspection system

Shuen-chen Lei, Hermes Liu, Mingsheng Tsai, Hung-Chi Wu, Hong Xiao, Jack Jau

Proceedings Volume 6518, 65184I (2007) https://doi.org/10.1117/12.711761

KEYWORDS: Inspection, Virtual colonoscopy, Transmission electron microscopy, Defect inspection, Semiconducting wafers, Oxides, Scanning electron microscopy, Tungsten, Defect detection, Sensors

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Proceedings Article | 24 March 2006 Paper

Leakage monitoring and control with an advanced e-beam inspection system

Hermes Liu, J. H. Yeh, Chan Lon Yang, S. C. Lei, J. Y. Kao, Y. D. Yang, Mingsheng Tsai, S. F. Tzou, Wei-Yih Wu, Hong-Chi Wu, Hong Xiao, Jack Jau

Proceedings Volume 6152, 615249 (2006) https://doi.org/10.1117/12.656207

KEYWORDS: Semiconducting wafers, Inspection, Scanning electron microscopy, Diffusion, Nickel, Tungsten, Defect detection, Failure analysis, Control systems, Defect inspection

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Proceedings Article | 24 March 2006 Paper

High-throughput contact critical dimension and gray level value measurement

Hong Xiao, Wei Fang, Yan Zhao, Mark Huang, Kai Wang, Darren Wong, Jack Jau

Proceedings Volume 6152, 61523L (2006) https://doi.org/10.1117/12.656978

KEYWORDS: Semiconducting wafers, Critical dimension metrology, Scanning electron microscopy, Bismuth, Finite element methods, Etching, Image processing, Inspection, Sensors, Photomasks

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Proceedings Article | 24 March 2006 Paper

High-resistance W-plug monitoring with an advance e-beam inspection system

Hermes Liu, J. H. Yeh, Chan Lon Yang, S. C. Lei, J. Y. Kao, Y. D. Yang, Mingsheng Tsai, S. F. Tzou, Wei-Yih Wu, Hong-Chi Wu, Hong Xiao, Jack Jau

Proceedings Volume 6152, 61524A (2006) https://doi.org/10.1117/12.656217

KEYWORDS: Inspection, Scanning electron microscopy, Semiconducting wafers, Transmission electron microscopy, Defect detection, Resistance, Electron microscopes, Tungsten, Failure analysis, Electron beams

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Showing 5 of 16 publications

Course Instructor

SC1009: Introduction to Scanning Electron Microscope (SEM) Applications of Defect Inspection and Review in IC Manufacturing

This course explains basic principles and applications of defect electron beam inspection (EBI) and defect e-beam review (EBR). The primary goals of the course are to describe the basic of SEM imaging, defect behavior in the SEM image, case studies of EBI and EBR applications in semiconductor process development and high-volume manufacturing (HVM). Basics principles of design for inspection (DFI) and some case studies of EBI test circuit design are also covered.

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