In this study, we used optimized negative mode to detect N+/P-well contact open and P+/N-well
contact leakage. We found the optimized contact process condition to eliminate both contact open
and leakage. Electron beam (e-beam) inspection results strongly correlate with die yield. We
implemented negative mode e-beam defect inspection along with positive mode inspection for
effective inline monitoring to accelerate the 65 nm process yield ramp.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.