Commercial introduction of emerging integrated photonics technologies requires a long and complex multi-layer product development, industrialization, and qualification cycles at all levels of value chain from initial product design, material sourcing, component-system-module manufacturing, and testing, through marketing and delivery of new products to the market. Scalable assembly and packaging of electronic-photonic integrated modules is important and may take more than a half of the entire product’s costs. In this paper, we will report on some of our industrial processes for scalable photonics packaging, as well as challenges and results obtained from our research and innovation projects.
In this paper, we present the development of a miniaturized Laser Doppler Vibrometer (LDV) system, based on the 3D hybrid integration of the Si3N4 platform of LioniX (TriPleX) and the polymer platform of FhG-HHI (PolyBoard). The photonic integrated circuit (PIC) supports all the functionalities of an LDV system including the splitting of the input light to the measurement and the reference beam, the introduction of an optical frequency shift up to 100 kHz, polarization handling and detection of the reflected measurement beam, using a heterodyne detection technique. The optical frequency shift is accommodated in the TriPleX section of the PIC based on a simple serrodyne scheme, where a phase modulator is driven with a sawtooth signal with the desired frequency. The modulation of the optical field is based on the stress-optic effect utilizing thin-films of PZT deposited on top of the waveguide structures of the TriPleX platform, capable of supporting modulation frequencies up to several MHz. The PolyBoard part enables polarization handling and heterodyne detection of the reflected beam using micro-optic elements on chip, including a polarization beam splitter (PBS), a half wave plate (HWP), and a pair of balanced detectors with four photodiodes that are flip chip bonded on the top. The TriPleX and the PolyBoard platform were brought together based on the 3D hybrid integration, using mode size converters and vertical directional couplers with coupling losses lower than 15 dB. On-chip beating, using the integrated photodiodes is experimentally demonstrated.
Photonic integrated circuits (PICs) are one of the key enablers for beyond 5G networks. A novel generation of fully integrated photonic-enabled transceivers operating seamlessly in W- D- and THz-bands is developed within the EU funded project TERAWAY. Photonic integration technology enables key photonic functionalities on a single PIC including photonic up/down conversion. For efficient down-conversion at the photonic integrated receiver, we develop the first waveguide-fed photoconductive antenna for THz communications. Finally, we report on the experimental implementation of a fully photonic-enabled link operating across W- D- and THz-bands.
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