Near-infrared (NIR) spectroscopy has acquired widespread adoption in various sectors as a result of its benefits over other analytical techniques, the most notable of which is the ability to record spectra for solid samples without any prior manipulation. Furthermore, advances in instrumentation have led to the creation of compact and high-speed spectrometers that can be used in a variety of scenarios, including hazardous materials identification. Fourier Transform NIR (FT-NIR) technology is one of the most useful tools for onsite analysis of chemical and biological substances. Herein, we propose a compact, portable FT-NIR spectroscopic sensor for field measurements, based on commercial broadband light source and spectrometer for detection of chemical precursors of explosives. We mainly focus on four compounds, ammonium nitrate, potassium nitrate, sodium nitrate and urea, some of the best-known chemical precursors of explosives with NIR content. A customized spectral library is constructed, including the forementioned substances under different environmental conditions. We emphasize on two basic factors that can affect the NIR spectra: the relative humidity and the ambient temperature. For the unknown spectrum identification, we evaluate prediction models which involve the use of Random Forest and Support Vector Machine, as well as the Hit Quality Index (HQI) value. The FT-NIR spectroscopic sensor additionally includes an integrated communication module that provides measurement spectra and results to a novel edge computing platform, called DECIoT. We demonstrate the operation of the FT-NIR spectroscopic sensor in real settings under humidity, straight sunlight, and temperature fluctuations, achieving maximum accuracy of 0.96.
Existing transceiver technology inside data centers will soon reach its limits due to the enormous traffic growth rates driven by new, bandwidth-hungry applications. Efforts to develop the next generation of 800Gbps and 1.6Tbps transceivers for intra-DC optical interconnects have already kicked-off to address the demands in traffic, the exhaustion of the ports at the digital switches and the power consumption limitations inherent to the use of many lower capacity modules. The new generation of optical modules must also provide Terabit capacities at low cost, necessitating the use of high-volume manufacturing processes. TERIPHIC is an EU funded R and D project that aims at developing transceiver modules with up to 1.6 Tbps capacity over 16 lanes in duplex fiber and cost less than 1 € per Gbps for distances up to 2 km, utilizing PAM-4 modulation for 100Gbps per lane and high-volume production compatible transceiver designs. At the component level, TERIPHIC will rely on arrays of high-speed electronics, InP Externally Modulated Lasers (EMLs) and InP photodetectors, and at the integration level it will rely on a polymer photonic platform as a host motherboard, leveraging its flexibility and powerful toolbox. A summary of the progress on the TERIPHIC transceiver modules concept, both at the component level and integration level is presented in this paper.
We present simulation and characterization results for the design of a two-port grating coupler with achievable coupling efficiency up to 54% together with simulation and characterization results of three different multimode interference (MMI) coupler structures, 1x2, 1x4 and 1x8 with insertion loss and output power imbalance as low as 0.2 dB and 0.05 dB, respectively. Both grating coupler and MMI photonic structures were designed on the TriPleX platform. Finally, we present these structures as part of a novel, photonic, ultrasensitive biosensor.
We demonstrate the hybrid integration of a multi-format tunable transmitter and a coherent optical receiver based on optical polymers and InP electronics and photonics for next generation metro and core optical networks. The transmitter comprises an array of two InP Mach-Zehnder modulators (MZMs) with 42 GHz bandwidth and two passive PolyBoards at the back- and front-end of the device. The back-end PolyBoard integrates an InP gain chip, a Bragg grating and a phase section on the polymer substrate capable of 22 nm wavelength tunability inside the C-band and optical waveguides that guide the light to the inputs of the two InP MZMs. The front-end PolyBoard provides the optical waveguides for combing the In-phase and Quadrature-phase modulated signals via an integrated thermo-optic phase shifter for applying the pi/2 phase-shift at the lower arm and a 3-dB optical coupler at the output. Two InP-double heterojunction bipolar transistor (InP-DHBT) 3-bit power digital-to-analog converters (DACs) are hybridly integrated at either side of the MZM array chip in order to drive the IQ transmitter with QPSK, 16-QAM and 64-QAM encoded signals. The coherent receiver is based on the other side on a PolyBoard, which integrates an InP gain chip and a monolithic Bragg grating for the formation of the local oscillator laser, and a monolithic 90° optical hybrid. This PolyBoard is further integrated with a 4-fold InP photodiode array chip with more than 80 GHz bandwidth and two high-speed InP-DHBT transimpedance amplifiers (TIAs) with automatic gain control. The transmitter and the receiver have been experimentally evaluated at 25Gbaud over 100 km for mQAM modulation showing bit-error-rate (BER) performance performance below FEC limit.
Hybrid photonic integration allows individual components to be developed at their best-suited material platforms without sacrificing the overall performance. In the past few years a polymer-enabled hybrid integration platform has been established, comprising 1) EO polymers for constructing low-complexity and low-cost Mach-Zehnder modulators (MZMs) with extremely high modulation bandwidth; 2) InP components for light sources, detectors, and high-speed electronics including MUX drivers and DEMUX circuits; 3) Ceramic (AIN) RF board that links the electronic signals within the package. On this platform, advanced optoelectronic modules have been demonstrated, including serial 100 Gb/s [1] and 2x100 Gb/s [2] optical transmitters, but also 400 Gb/s optoelectronic interfaces for intra-data center networks [3]. To expand the device functionalities to an unprecedented level and at the same time improve the integration compatibility with diversified active / passive photonic components, we have added a passive polymer-based photonic board (polyboard) as the 4th material system. This passive polyboard allows for low-cost fabrication of single-mode waveguide networks, enables fast and convenient integration of various thin-film elements (TFEs) to control the light polarization, and provides efficient thermo-optic elements (TOEs) for wavelength tuning, light amplitude regulation and light-path switching.
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