Mr. Keith Hong Profile

Keith Hong

at Teledyne Imaging Sensors

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Publications (1)

Proceedings Article | 29 August 2022 Presentation + Paper

Packaging design and test of cryogenic readout electronics for the Euclid Near Infrared Spectrophotometer

W. Holmes, H. Aghakians, S. Avasapian, A. Bahraman, A. Berg, A. Beyer, E. Boehmer, R. Calvet, S. Cheung, B. Cho, H. Cho, A. Cillis, L. DelCastillo, M. Dickie, G. Delo, M. Farris, A. Feizi, N. Ferraro, L. Fischer, R. Foltz, N. Hambarsoumian, K. Hong, T. Huang, M. Jhabvala, Er. Kan, R. Kopp, B. Krohn, D. Lewis, M. Loose, K. MacNeal, J. Maiten, D. Markley, G. Maldonado, J. Mehta, J. Melendez, A. Morgan, J. Mulder, M. Ngyuen, N. Ovee, M. Pniel, S. Pravdo, D. Randall, J. Riendeau, A. Runkle, M. Runyan, M. Seiffert, M. Skalare, P. Tan, A. Turner, S. Van Nostrand, A. Waczynski, J. Wu

Proceedings Volume 12191, 121911U (2022) https://doi.org/10.1117/12.2629611

KEYWORDS: Cryogenics, Electronics, Reliability, Aluminum, Silicon, Interfaces, Packaging, Analog electronics, Temperature metrology, Gold

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