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Johnny Melendez
at Jet Propulsion Lab
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Author
Publications (1)
Proceedings Article | 29 August 2022 Presentation + Paper
Packaging design and test of cryogenic readout electronics for the Euclid Near Infrared Spectrophotometer
W. Holmes, H. Aghakians, S. Avasapian, A. Bahraman, A. Berg, A. Beyer, E. Boehmer, R. Calvet, S. Cheung, B. Cho, H. Cho, A. Cillis, L. DelCastillo, M. Dickie, G. Delo, M. Farris, A. Feizi, N. Ferraro, L. Fischer, R. Foltz, N. Hambarsoumian, K. Hong, T. Huang, M. Jhabvala, Er. Kan, R. Kopp, B. Krohn, D. Lewis, M. Loose, K. MacNeal, J. Maiten, D. Markley, G. Maldonado, J. Mehta, J. Melendez, A. Morgan, J. Mulder, M. Ngyuen, N. Ovee, M. Pniel, S. Pravdo, D. Randall, J. Riendeau, A. Runkle, M. Runyan, M. Seiffert, M. Skalare, P. Tan, A. Turner, S. Van Nostrand, A. Waczynski, J. Wu
Proceedings Volume 12191, 121911U (2022) https://doi.org/10.1117/12.2629611
KEYWORDS: Cryogenics, Electronics, Reliability, Aluminum, Silicon, Interfaces, Packaging, Analog electronics, Temperature metrology, Gold
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