Dr. Jiahui Wang Profile

Dr. Jiahui Wang

at imec

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Publications (6)

Proceedings Article | 12 November 2024 Presentation + Paper

Unfolding the curves: novel designs and metrology methods for curvilinear masks qualification

Darko Trivković, Xuelong Shi, Yi-Pei Tsai, Chieh-Miao Chang, Jane Wang, Victoria Malacara, Balakumar Baskaran, Youssef Drissi, Joost Bekaert, Kenichi Miyaguchi

Proceedings Volume 13216, 132160I (2024) https://doi.org/10.1117/12.3036470

KEYWORDS: Photomasks, Critical dimension metrology, Metrology, Optical proximity correction, Manufacturing, Semiconducting wafers, Logic, Industry, Industrial applications, Silicon photonics

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Proceedings Article | 10 April 2024 Presentation + Paper

EUV lithography: LER design, mask, and wafer impact

Jiahui Wang, Emily Gallagher, Jeroen Van de Kerkhove, Rik Jonckheere, Darko Trivkovic

Proceedings Volume 12953, 129530A (2024) https://doi.org/10.1117/12.3011038

KEYWORDS: Line edge roughness, Semiconducting wafers, Design, Tunable filters, Light sources and illumination, Extreme ultraviolet lithography, Scanning electron microscopy, Scanners, Optical filters, Image analysis

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Proceedings Article | 28 April 2023 Poster + Paper

Productivity enhancement study: yield, cost, and turn-around-time modeling for EUV and high NA EUV

Yi-Pei Tsai, Yi-Han Chang, Jane Wang, Darko Trivkovic, Kurt Ronse, Ryoung-Han Kim

Proceedings Volume 12495, 124951U (2023) https://doi.org/10.1117/12.2658866

KEYWORDS: Extreme ultraviolet, Semiconducting wafers, Photomasks, Fin field effect transistors, Optical lithography, Front end of line, Manufacturing, Back end of line, Yield improvement, Extreme ultraviolet lithography

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Proceedings Article | 26 May 2022 Presentation + Paper

A yield prediction model and cost of ownership for productivity enhancement beyond imec 5nm technology node

Yi-Pei Tsai, Yi-Han Chang, Jane Wang, Darko Trivkovic, Kurt Ronse, Ryoung-Han Kim

Proceedings Volume 12052, 1205203 (2022) https://doi.org/10.1117/12.2617415

KEYWORDS: Extreme ultraviolet, Semiconducting wafers, Photomasks, Manufacturing, Optical lithography, Yield improvement, Front end of line, Semiconductor manufacturing, Performance modeling, Back end of line

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Proceedings Article | 12 October 2021 Presentation + Paper

Analysis of advanced technology nodes and h-NA EUV introduction: a cost perspective

Gioele Mirabelli, Jane Wang, Darko Trivkovic, Pieter Weckx, Alessio Spessot, Kurt Ronse, Ryoung Han Kim, Geert Hellings, Julien Ryckaert

Proceedings Volume 11854, 118540D (2021) https://doi.org/10.1117/12.2600804

KEYWORDS: Extreme ultraviolet, Optical lithography, Metals, Lithography, Extreme ultraviolet lithography, Back end of line, Semiconducting wafers, Standards development, Front end of line, Very large scale integration

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Proceedings Article | 23 March 2020 Presentation + Paper

Cost-performance optimization of fine-pitch W2W bonding: functional system partitioning with heterogeneous FEOL/BEOL configurations

Dragomir Milojevic, Eric Beyne, Geert Van der Plas, Jane Wang, Peter Debacker

Proceedings Volume 11328, 113280R (2020) https://doi.org/10.1117/12.2552036

KEYWORDS: Back end of line, Semiconducting wafers, Logic, System integration, 3D imaging standards, 3D modeling, Metals, Front end of line, Computing systems, Information operations

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Showing 5 of 6 publications

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