KEYWORDS: Scanning electron microscopy, Virtual colonoscopy, System on a chip, Logic devices, Maskless lithography, Lenses, Semiconducting wafers, Inspection, Electron beam direct write lithography, Lithography
In order to realize SoC (System on a Chip) fabrication at low cost with quick-TAT (Turn-Around-Time) we have proposed a maskless lithography (ML2) strategy, a low-energy electron-beam direct writing (LEEBDW) system with a common character projection (CP) aperture. This paper presents a status report on our proof-of-concept (POC) system. We have developed a compact EB column consisting small electrostatic lenses and deflectors. The experimental results for our POC system indicated that the patterns corresponding to 50nm-node logic devices can be obtained with CP exposure at the incident energy of 5 keV. The technique to reduce the raw process time using a SEM function of LEEBDW system is also reported.
KEYWORDS: Back end of line, Vestigial sideband modulation, Logic devices, Metals, Data processing, Photomasks, Electron beams, Electron beam direct write lithography, Computer aided design, Beam shaping
Electron beam direct writing (EBDW) system is at the head of systems fabricating circuit patterns by maskless. But the throughput of EBDW is very poor beause very large number of electron beam (EB) shots are requested for exposure of whole patterns on a wafer. We had proposed methods of reduction of the number of EB shots with Character Projection (CP) and designing the best devicve pattern for CP-EBDW to fabricate logic devices such as ASIC or SoC device. Though the method is effective to Front-End-Of-Line (FEOL) layers of cell based logic deviec, Back-End-Of-Line (BEOL) layers cannot be exposed by the method with small number of characters and EB shots. Now, we will propose methods for appropriate CP exposure and data processign for patterns in BEOL layers. By the methods, each BEOL layer in a typical logic device cna be exposed with throughputs about 6 to 8 wafers/h, with a Low-energy-EBDW system produced by e-BEAM Corporation, named "EBIS".
KEYWORDS: Clouds, Data acquisition, Data archive systems, Data centers, Data processing, Data modeling, Calibration, Sensors, Satellites, Short wave infrared radiation
ASTER (Advanced Thermal Emission and Reflection Radiometer) was launched on December 19th, 1999, from Vandenberg, California, USA, and has been circulating the Earth on a NASA platform called Terra. After the Initial Checkout Phase, ASTER started the normal operation on September 20th, 2000, and ERSDAC started ASTER data distribution on December 1st, 2000. Data Acquisition by ASTER is quite stable at a daily rate of about 600 scenes. The resulting total number of acquired scenes is 439 thousands scenes as of June 28th, 2002. This number is equivalent to more than ten times the number of scenes covering all the land areas on the earth. ASTER GDS takes an operational sequence in which the observation schedule is updated by using Cloud Prediction Data immediately before the observation. Therefore, this scheduling operation allows us to acquire the data with less cloud cover. All the acquired data are downloaded at NASA and are shipped to ERSDAC via physical media and, for some small number, via network. All the acquired data are processed to Level 1A at ASTER GDS first, and the total number as of June 28th, 2002, is about 352 thousands scenes. Next, Level 1B processing is performed for the data requested by users and the data with less than 20% cloud cover. The total number of Level 1B data is about 80 thousands scenes as of June 28th, 2002.
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