Mr. Ryan Ley Profile

Ryan Ley

at Applied Materials Inc

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Author

Publications (2)

Proceedings Article | 9 April 2024 Presentation + Paper

Performance comparison of photosensitive polyimides for high-resolution dual-damascene schemes for FOWLP packaging applications

Luisa Bozano, Roger Quon, Ben Briggs, Ryan Ley, Athena Pang, Peng Suo, Prayudi Lianto, Andy Yong, Arvind Sundarrajan, Jorge Fernandez, Niranjan Khasgiwale, C. C. Chuang, Jang Fung Chen, Siddarth Krishnan, Mike Chudzik, Chris Bencher

Proceedings Volume 12957, 129570X (2024) https://doi.org/10.1117/12.3010203

KEYWORDS: Film thickness, Advanced packaging, Electrical properties, Polyimides, Packaging, Lithography, Image processing, Dielectrics, Materials properties, Chemical mechanical planarization

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Proceedings Article | 5 March 2021 Presentation

III-nitride strain relaxation enabled by porous GaN for optoelectronic applications

Shubhra Pasayat, Chirag Gupta, Matthew Wong, Ryan Ley, Yifan Wang, Stacia Keller, Steven DenBaars, Shuji Nakamura, Umesh Mishra

Proceedings Volume 11706, 117060C (2021) https://doi.org/10.1117/12.2577008

KEYWORDS: Quantum wells, Light emitting diodes, Aluminium gallium indium phosphide, Indium, Gallium nitride, Optoelectronics, Indium gallium nitride, Green light emitting diodes, Display technology

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