Mr. Himanandhan Reddy Kottur Profile

Himanandhan Reddy Kottur

at Univ. of Florida

SPIE Involvement:

Author

Publications (1)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 24 October 2024 Poster + Paper

Challenges and opportunities in non-destructive characterization of stacked IC packaging: insights from SAM and 3D x-ray analysis

Nitin Varshney, Shajib Ghosh, Patrick Craig, Himanandhan Reddy Kottur, Hamed Dalir, Navid Asadizanjani

Proceedings Volume 13152, 1315225 (2024) https://doi.org/10.1117/12.3027317

KEYWORDS: Nondestructive evaluation, Inspection, X-rays, Packaging, Failure analysis, Advanced packaging, Acoustics, 3D image processing, X-ray microscopy, X-ray imaging

Read Abstract +

This study scrutinizes the limitations and challenges of applying non-destructive techniques such as Scanning Acoustic Microscopy (SAM) and 3D x-ray imaging for testing 3D and 2.5D integrated circuit (IC) packaging configurations. As the semiconductor industry moves towards advanced packaging technologies like 2.5D and 3D heterogeneous integration, which integrates various dies or chiplet components vertically and horizontally to enhance device performance and reduce costs, ensuring the reliability of these complex structures becomes paramount. This paper presents a comprehensive review of the current state-of-the-art non-destructive methods used for physical inspection, characterization, and failure analysis, with a focus on SAM and 3D x-ray imaging. It discusses the pressing challenges faced by these methods due to ongoing miniaturization and the need for high precision in inspecting densely packed components. An empirical investigation is conducted through a case study of a multi-die advanced packaging scenario to evaluate the practical utility of SAM and 3D x-ray techniques. This examination includes comparisons of resolution, analysis window size, aiming to understand the benefits of integrating these imaging modalities. The study also explores the future needs and opportunities for advancement in imaging hardware and algorithm development for automated signal interpretation and AI-assisted defect detection. This investigation highlights the critical role of non-destructive methods in advancing semiconductor packaging technologies while addressing their current limitations and the path forward for enhancing IC package integrity and reliability.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years