SiC ceramics have excellent physical and chemical properties, and have been extensively researched and used in electronics, optics, semiconductor and other fields. However, due to its high strength, high hardness and other characteristics, the conventional processing of SiC ceramics faces a series of challenges. Laser processing has become an effective processing technology due to its unique advantages. In this paper, the single pulse ablation tests of SiC ceramic with different powers were performed by using infrared femtosecond laser. The single pulse ablation threshold of SiC ceramic was calculated by using equivalent diameter method and equivalent area method, and the influence of laser power on the depth of the ablation hole was discussed. The results show that when the repetition frequency is 25kHz and the wavelength is 1035nm, the laser ablation values calculated by the equivalent diameter method and the equivalent area method are 0.3454 J/cm2 and 0.3268 J/cm2, respectively. Within a certain laser power range or reaching a certain ablation hole depth, the ablation hole depth augments with the increment of laser power. Beyond a specified laser power range, the hole depth decreases with the increment of laser power due to the effect of plasma shielding and recasting layer.
Due to the characteristics of high hardness, wear resistance, corrosion resistance, excellent thermal shock resistance, and low thermal expansion coefficient, Si3N4 ceramics are widely used in aerospace, national defense, electronic and electrical, mechanical, chemical, and other fields. In this paper, the grooving experiments of Si3N4 ceramics were carried out by using a novel dual-beam coupled nanosecond pulse laser, and the influence of laser power and scanning speed on the surface morphology and geometric size of grooves were studied. The results show that the laser power has a significant effect on the surface morphology and geometric size of grooves. With the increase of laser power, the laser power density augments, and the width and depth of grooves increase. The groove width and groove depth first increase and then decrease with the increase of scanning speed, and both the groove width and depth reach the maximum value at scanning speed of 800 mm/min.
With the rapid development of advanced manufacturing technology, the market demand for high-precision functional curved surface parts is increasing. The traditional processing technology has shortcomings in the precision forming of curved parts, especially in the processing of functional and fine structures. Laser processing has the characteristics of non-contact, high precision, and controllable energy, which makes it have special advantages in machining highperformance surfaces. This paper analyzed the application requirements of high-precision complex surface processing and the differences between traditional surface processing methods and curved surface laser processing. A five-axis CNC laser processing technology for curved surfaces was proposed. At the same time, the digital modeling and laser machining simulation verification of a typical curved surface part were carried out by using this processing technology. The result proves the effectiveness of the digital processing flow of curved surface laser machining and provides a digital solution for laser machining of high-precision and complex curved surfaces.
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