Prof. Tsu-Jae King Liu Profile

Prof. Tsu-Jae King Liu

at Univ of California Berkeley

SPIE Involvement:

Author

Publications (1)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 26 March 2019 Paper

Tilted ion implantation of spin-coated SiARC films for sub-lithographic and two-dimensional patterning

Thomas Rembert, Daniel Connelly, Shalini Sharma, Leonard Rubin, Tsu-Jae King Liu

Proceedings Volume 10958, 109581F (2019) https://doi.org/10.1117/12.2515154

KEYWORDS: Optical lithography, Etching, Argon, Monte Carlo methods, Ion implantation, Photoresist materials, Photomasks, Silicon, Semiconducting wafers, Wet etching

Read Abstract +

Tilted ion implantation (TII) used in conjunction with pre-existing masking features on the surface of a wafer is a promising cost-effective method for self-aligned double-patterning. Recent work experimentally demonstrated pitch-halving by masked TII into a thermally grown SiO₂ hard-mask layer: the wet etch rate of SiO₂ increases dramatically if the implant-induced damage exceeds a threshold level, so that implanted regions (vs. non- implanted SiO₂ regions) can be selectively removed in dilute hydrofluoric acid solution. In this work, this method is extended to a silicon anti-reflection coating (SiARC) deposited by spin-coating and processed at temperatures compatible with back-end-of-line processing. Negative-tone patterning is achieved by implanting a 10 nm-thick SiARC film with Ar+ species at low energies (less than 5 keV) to reduce the wet etch rate. In general, the higher the implant dose, the greater the etch rate contrast between implanted vs. non-implanted regions of the SiARC layer. In principle, the TII method can be extended to form patterns with dimensions that extend in two orthogonal directions, i.e., two-dimensional (2D) patterns. In this work, the use of TII for 2D patterning is investigated via Monte Carlo simulations to study the effect of implantation dose and varying degrees of overlap between implanted regions extending along orthogonal directions. Stochastic effects on pattern fidelity are systematically investigated. The capability of TII to form sub-lithographic 2D patterns makes it advantageous for extending the era of Moores Law.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years