Nanoimprint lithography (NIL) is one of the most promising technology platforms for replication of nanometer and micrometer scale 3D topographies with extremely high resolution and throughput, as needed for e.g. photonic or optical applications. One of the remaining challenges of 3D NIL, however, is the fabrication of high quality 3D master originals – the initial patterns that are replicated multiple times in the NIL process. Here, we demonstrate a joint solution for 3D NIL where NanoFrazor thermal scanning probe lithography (t-SPL) is used to pattern the master templates with singlenanometer accurate 3D topographies. 3D topographies from polymer resist master templates are replicated using a HERCULES NIL system with SmartNIL technology. Furthermore, 3D patterns are transferred from the resist into a silicon substrate via reactive ion etching (RIE) and the resulting silicon master template is used for producing polymeric working stamps into OrmoStamp and, finally, replicas into optical grade OrmoClearFX material. Both replication strategies result in very high-quality replicas of the original patterns.
New critical dimension metrology methods such as critical dimension small angle X-ray scattering (CDSAXS) are being developed to meet the measurement challenges of next generation devices. Two key requirements for any new CD metrology method are non-destructiveness and the measurement speed. We will report on a study of beam damage and scattering strength of two model photoresist systems, HSQ and PMMA. We also will report on the status and initial results from NIST’s upgraded lab CDSAXS system.
50 nm pitch line gratings were fabricated in HSQ and PMMA films using EUV interference lithography at the Swiss Light Source. The lines were about 30 nm tall and 20-30 nm wide. The 17 keV CDSAXS exposure time was varied from 0.1 s to 60 s to determine the minimum X-ray exposure required to obtain a satisfactory fit. Normal incident measurements separated by a blanket X-ray exposure were repeated to measure the decrease in scattering intensity with X-ray dose. The PMMA scattering signal was found to decrease by about 80 % before stabilizing at around 15 % of the original scattering intensity. The HSQ scattering signal decreased much less and stabilized at about 80 % of the original scattering intensity. We also conducted a series of variable-angle CDSAXS measurements as a function of blanket X-ray exposure to determine how the shape of the photoresist lines changed during X-ray exposure. For PMMA, we found the line width to remain constant and the line height to decrease from 25 nm to 10 nm during the exposure series. The exposures that damaged the samples corresponded to several hours of exposure to the synchrotron beam in a 100 µm spot and were much longer than what was required to characterize the line gratings. Smaller targets result in a larger dose and could potentially damage the resist in the time required to make a CDSAXS measurement. The large differences in beam damage between PMMA and HSQ show that resist damage from CDSAXS will depend on the particular resist chemistries and target size.
As the lithographic resolution in semiconductor device manufacturing increases photoresist thickness cannot keep the same pace because of limitations set by pattern transfer. This leads to an increase in aspect ratios of patterned resist structures which in turn gives rise to pattern collapse that prevents the use of the patterned features for pattern transfer. Pattern collapse is caused by the capillary forces present on the resist surface during drying of the wafer. Therefore the best approach for mitigating pattern collapse is the complete removal of any drying steps from the processing of wafers after the lithography has been carried out. Several techniques achieving this have been presented. In this paper we propose a bottom-up strategy for pattern collapse mitigation where the wafers are brought from rinsing to further processing steps while they are still wet, thus avoiding the drying-induced pattern collapse without introducing additional processing steps.
Here, we present platinum and palladium mononuclear complexes with EUV photosensitivity and lithographic performance. Many platinum and palladium complexes show little or no EUV sensitivity; however, we have found that metal carbonates and metal oxalates (L2M(CO3) and L2M(C2O4); M=Pt or Pd) are sensitive to EUV. The metal carbonates give negative-tone behavior. The most interesting result is that the metal oxalates give the first positive-tone EUV resists based on mononuclear organometallic compounds. In particular, (dppm)Pd(C2O4) (dppm=1,1-bis(diphenylphosphino)methane) (23) prints 30-nm dense lines with Esize of 50 mJ/cm2. Derivatives of (23) were synthesized to explore the relationship between the core metal and the resist sensitivity. The study showed that palladium-based resists are more sensitive than platinum-based resists. The photoreaction has been investigated for two of our most promising resists, (dppm)Pd(C2O4) (23) and (Ph2EtP)2PdC2O4 (27). Our experiments suggest the loss of CO2 and the formation of a zerovalent L4Pd complex upon exposure to light. We have identified dppm2Pd(δ(P)23.6) as the main photoproduct for (23) and (Ph2EtP)4Pd (δ(P)32.7) as the main photoproduct for (27).
Extreme ultraviolet (EUV) lithography is considered to be the most promising option to continue with the downscaling of integrated circuits in high-volume manufacturing. One of the main challenges, however, is the development of EUV resists that fulfill the strict sensitivity, resolution, and line-edge roughness specifications of future nodes. Here, we present our EUV resist screening results of a wide range of EUV resists in their developmental phase from our collaborators from around the world. Furthermore, we have carried out extensive experiments to improve the processing parameters of the resists as well as to identify the optimal wafer pretreatment methods in order to optimize the adhesion of the resist to the substrate. We show that even though significant improvements in performance of chemically amplified resists have been achieved, pattern collapse is still the major process-limiting factor as the resolution decreases below 14 nm half-pitch.
Extreme ultraviolet lithography (EUVL) is considered to be the most promising option to continue with the aggressive scaling required in high-volume manufacturing (HVM) of integrated circuits. One of the main challenges, however, is the development of EUV resists that fulfill the strict sensitivity, resolution, and line-edge roughness specifications of future nodes. Here, we present our EUV resist screening results of a wide range of EUV resists in their developmental phase from our collaborators from around the world. Furthermore, we have carried out extensive experiments to improve the processing parameters of the resists as well as to identify the optimal wafer pre-treatment methods in order to optimize the adhesion of the resist to the substrate. We show that even though significant improvements in performance of chemically amplified resists have been achieved, pattern collapse is still the major process-limiting factor as the resolution decreases below 14 nm half-pitch (HP).
We report mode-locking of an optically pumped VECSEL using a graphene-based saturable absorber mirror (GSAM). Self-starting and stable modelocked operation is demonstrated with 473 fs pulses at 1.5 GHz repetition rate and 949 nm center wavelength. Wavelength tuning is achieved over a 46 nm bandwidth. We discuss the mirror design, the fabrication of the GSAMs, and give an outlook on further optimization of the design, including dielectric top coatings to protect the graphene and to increase the flexibility in the design.
In the past decade, passively modelocked optically pumped vertical external cavity surface emitting lasers (OPVECSELs), sometimes referred to as semiconductor disk lasers (OP-SDLs), impressively demonstrated the potential for generating femtosecond pulses at multi-Watt average output powers with gigahertz repetition rates. Passive modelocking with a semiconductor saturable absorber mirror (SESAM) is well established and offers many advantages such as a flexible design of the parameters and low non-saturable losses. Recently, graphene has emerged as an attractive wavelength-independent alternative saturable absorber for passive modelocking in various lasers such as fiber or solid-state bulk lasers because of its unique optical properties. Here, we present and discuss the modelocked VECSELs using graphene saturable absorbers. The broadband absorption due to the linear dispersion of the Dirac electrons in graphene makes this absorber interesting for wavelength tunable ultrafast VECSELs. Such widely tunable modelocked sources are in particularly interesting for bio-medical imaging applications. We present a straightforward approach to design the optical properties of single layer graphene saturable absorber mirrors (GSAMs) suitable for passive modelocking of VECSELs. We demonstrate sub-500 fs pulses from a GSAM modelocked VECSEL. The potential for broadband wavelength tuning is confirmed by covering 46 nm in modelocked operation using three different VECSEL chips and up to 21 nm tuning in pulsed operation is achieved with one single gain chip. A linear and nonlinear optical characterization of different GSAMs with different absorption properties is discussed and can be compared to SESAMs.
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