The use of Digital Light Processing (DLP)-based technologies has driven innovation in industries such as additive manufacturing, metrology, lithography and, increasingly, biomedical research and bioprinting. In addition to image quality parameters (magnification, line contrast, distortion), two key characteristics govern the manufacturing success: intensity on the image plane, and Full On/Full Off (FO:FO) contrast. Both need to be balanced carefully in the illumination design. We discuss detailed considerations for developing an UV DLP projector. Specifically, by choosing TIR prism design rationale, fine tuning the exact geometry, tailoring the other illumination optics and an improved coating design, we achieve an illumination that is both high-contrast and high-intensity.
This work presents experimental and simulation results of a 3D measurement concept based on fiber-optic interference pattern generation. A demonstrator system which is able to adjust different optical and mechanical parameters is described. The results of parameter variation studies are discussed along with possible applications in the field of micro-optical 3D measurement systems like endoscopes. The experiments were prepared with different structures with various scattering properties. To implement that approach into a micro-optical 3D measurement system, the combination of distance variation between the fibers and a controlled phase shift introduced by a retarder can be used to design the system versatile.
Fabry-Pérot (FP) sensors have enabled high resolution 3D photoacoustic (PA) imaging in backward mode. However, raster-scanning of the interrogation laser beam across the sensor can result in slow 3D image acquisition. To overcome this limitation, parallelized PA signal acquisition can be used for which FP sensors with uniform optical thickness are required. In this work, the optical thickness is tuned a) irreversibly through the use of a photopolymer host matrix and b) actively using embedded electro-optic (EO) chromophores. Polymer spacers (5 μm) were deposited using spin coating and sandwiched between two dielectric mirrors and transparent ITO electrodes. The employed polymer guest-host system consists of an EO chromophore (2-methyl-4-nitroaniline) and poly(vinyl cinnamate). EO tuneability was induced using contact poling and a tuneability of 68 pm was demonstrated. The optical thickness was homogenised by raster scanning a UV beam whilst varying the exposure time across a 4 mm2 detection aperture.
Optical-resolution photoacoustic microscopy (PAM) has been shown to enable the acquisition of high resolution (μm) functional and anatomical images. For backward-mode operation, conventional piezoelectric ultrasound transducers need to be placed far away from the signal source due to their opacity and size. This can result in reduced acoustic sensitivity. Planar Fabry-Perot polymer film interferometer (FPI) sensors have the potential to overcome this limitation since they are transparent to the excitation wavelength, can be placed immediately adjacent to the signal source for high acoustic sensitivity, and offer a broadband frequency response (0 –50 MHz). In this study, we present a high frame rate, backward-mode OR-PAM system based on a planar FPI ultrasound sensor. A ns-pulsed laser provides excitation pulses (<200 nJ, maximum pulse repetition frequency = 200 kHz, 532 nm) to generate photoacoustic waves that are detected using a planar FPI sensor interrogated at 765-781 nm. For backwardmode operation and highest acoustic sensitivity, the excitation and interrogation beams are coaxially aligned and rasterscanned. The optical transfer function of the sensor, the spatial resolution and the detection sensitivity were determined to characterise the set-up. Images of a leaf phantom and first in vivo images of zebrafish larvae were acquired. This approach will enable fast 3D OR-PAM with high resolution and high sensitivity for functional and molecular imaging applications. FPI-based ultrasound detection also has the potential to enable dual-mode optical- and acousticresolution PAM and the integration of photoacoustic imaging with purely optical modalities such as multi-photon microscopy.
To improve the feasibility of endoscopic inspection processes we developed a system that provides online information about position, orientation and viewing direction of endoscopes, to support the analysis of endoscopic images and to ease the operational handling of the equipment. The setup is based on an industrial endoscope consisting of a camera, various MEMS and multimodal data fusion. The software contains algorithms for feature and geometric structure recognition as well as Kalman filters. To track the distal end of the endoscope and to generate 3D point cloud data in real time the optical and photometrical characteristics of the system are registered and the movement of the endoscope is reconstructed by using image processing techniques.
The correct identification of the third-order nonlinear optical effect of stimulated Raman scattering (SRS) led in the last years to a versatile method to generate new laser wavelengths resulting from a photon-phonon-interaction. There is the possibility to down- (Stokes) or up-shifting (anti-Stokes) of the pump laser frequency. The size of the frequency shift depends on the Raman-active material and the excitability of their SRS-promoting vibration-modes. Prominent Raman crystals include BaNO3 and other nitrates, KGW and other tungstates, YVO4 and other vanadates as well as diamond. Recently, we observed SRS in the laser crystal LuAlO3 with one SRS-active phonon mode and the natural crystal Spodumene (α-LiAlSi2O6), which has three corresponding SRS-active vibration modes.
Selective amplification of one particular spectral line generated through SRS is possible by placing the Raman crystal into a frequency-selective optical resonator, whose optical feedback is selective for only one Stokes- or anti-Stokes component. Raman lasers can be used in many applications, e.g. differential absorption LIDAR systems (DIAL, Light Detection and Ranging) to detect trace gases like carbon dioxide (CO2), ozone (O3) or water vapor (H2O). Various pumping schemes and resonator designs have been investigated focusing on good conversion efficiency, high spatial beam quality and high pulse energy of the output beam. The DIAL technique requires laser sources with high average output power combined with an excellent beam quality (M2 < 2). One possible solution can be found in an effect called beam-cleanup, which takes place by using Raman lasers and amplifiers.
Fabry-Pérot (FP) polymer film sensors exhibit small element sizes, high acoustic sensitivity, transparency and flat frequency response to enable high resolution 3D photoacoustic (PA) imaging in backward mode. However, conventional raster scan interrogation can result in slow data acquisition (several min for 3D images) compared to parallelized piezoelectric detector arrays. To address this limitation, parallelization using a camera-based readout of FP sensors is investigated. This approach requires the optical thickness of the polymer spacer to be sufficiently uniform over the scan area to obtain high acoustic sensitivity for all active elements. Since the deposition of passive polymer layers with sufficient homogeneity of thickness is challenging, the use of electro-optically (EO) or piezoelectric (PE) tunable polymer film spacers is investigated. The spacers are sandwiched between two dielectric mirrors and transparent electrodes to form an FP sensor. In this work, spin coated guest-host systems consisting of EO chromophores (2-methyl-4-nitroaniline) embedded in a PMMA matrix, and thermally evaporated PE film spacers (PVDF) were examined. Both systems were electrically poled using a corona discharge. The optical transfer function, the transmission spectrum of the excitation passband from 600 nm to 1100 nm and the tuning range of the FP sensors were determined. Furthermore, the detection of PA waves was demonstrated. Tunable FP sensors in conjunction with camera-based interrogation techniques have the potential to provide 3D image acquisition times on the order of seconds.
Through Silicon Via (TSV) technology is a key feature of new 3D integration of circuits by creation of interconnections
using vias, which go through the silicon wafer. Typically, the highly-selective Bosch Si etch process, characterized by a
high etch rate and high aspect ratio and forming of scallops on the sidewalls is used. As presented in this paper, we have
developed an experimental setup and a respective evaluation algorithm for the control and monitoring of very high aspect
ratio TSV profiles by spectroscopic reflectometry. For this purpose square via arrays with lateral dimension from 3 to
10 μm were fabricated by a Bosch etch process and analyzed by our setup. By exploiting interference and diffraction
effects of waves reflected from the top and bottom surfaces as well as from the side walls of the TSV patterns, the
measurements provided etch depths, CD values and scallop periods. The results were compared with data obtained by a
commercial wafer metrology tool. Aspect ratios of up to 35:1 were safely evaluable by our setup.
In this study, we present the experimental investigations on interference patterns, such as those already reported in VIMOS-IFU, and up to now no appropriate explanation has been presented. These interference patterns are produced in multimode fibres coated with acrylate or polyimide, which is the preferred coating material for the fibres used in IFUs. Our experiments show that, under specific conditions, cladding modes interact with the coating and produce interference. Our results show that the conditions at which the fibre is held during data acquisition has an impact in the output spectrum. Altering the positioning conditions of the fibre leads to the changes into the interference pattern, therefore, fibres should be carefully manipulated in order to minimise this potential problem and improve the performance of these instruments. Finally we present a simple way of predicting and modelling this interference produced from the visible to the near infrared spectra. This model can be included in the data reduction pipeline in order to remove the interference patterns.
These results should be of interest for the optimisation of the data reduction pipelines of instruments using optical fibres. Considering these results will benefit innovations and developments of high performance fibre systems.
In this work, we present for the first time a partially slotted silicon ring resonator (PSRR) covered with an electro-optical polymer (Poly[(methyl methacrylate)-co-(Disperse Red 1 acrylate)]). The PSRR takes advantage of both a highly efficient vertical slot waveguide based phase shifter and a low loss strip waveguide in a single ring. The device is realized on 200 mm silicon-on-insulator wafers using 248 nm DUV lithography and covered with the electro-optic polymer in a post process. This silicon-organic hybrid ring resonator has a small footprint, high optical quality factor, and high DC device tunability. A quality factor of up to 105 and a DC device tunability of about 700 pm/V is experimentally demonstrated in the wavelength range of 1540 nm to 1590 nm. Further, we compare our results with state-of-the-art silicon-organic hybrid devices by determining the poling efficiency. It is demonstrated that the active PSRR is a promising candidate for efficient optical switches and tunable filters.
In this work, a measurement concept based on triangulation was developed for borescopic 3D-surveying of surface defects. The integration of such measurement system into a borescope environment requires excellent space utilization. The triangulation angle, the projected pattern, the numerical apertures of the optical system, and the viewing angle were calculated using partial coherence imaging and geometric optical raytracing methods. Additionally, optical aberrations and defocus were considered by the integration of Zernike polynomial coefficients. The measurement system is able to measure objects with a size of 50 μm in all dimensions with an accuracy of ± 5 μm. To manage the issue of a low depth of field while using an optical high resolution system, a wavelength dependent aperture was integrated. Thereby, we are able to control depth of field and resolution of the optical system and can use the borescope in measurement mode with high resolution and low depth of field or in inspection mode with low resolution and higher depth of field. First measurements of a demonstrator system are in good agreement with our simulations.
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