NEO Surveyor is a NASA Planetary Defense Coordination Office mission designed to detect and track >2/3 of potentially hazardous asteroids >140 m in diameter during its 5-year prime mission. NEO Surveyor entered Phase B in June 2021 and is scheduled to launch in 2026 to survey the sky in two infrared bands. The infrared detectors are a key technology for the mission and have been the subject of focused development for more than a decade. In this paper, we report test results for recently produced detectors and describe design elements of the focal plane module relevant to operations for NEO Surveyor.
KEYWORDS: James Webb Space Telescope, Sensors, Spectrographs, Staring arrays, Near infrared, Space telescopes, Silicon, Infrared sensors, Infrared telescopes, Cameras
The Near Infrared Spectrograph (NIRSpec) will be the James Webb Space Telescope's (JWST's) primary near-infrared spectrograph. NIRSpec is a multi-object spectrograph with fixed-slit and integral field modes. EADS/Astrium is building NIRSpec for the European Space Agency (ESA), with NASA is providing the detector subsystem and programmable multi-aperture mask. In this paper, we summarize recent progress on the detector subsystem including tests demonstrating that JWST's Rockwell HAWAII-2RG sensor chip assemblies have achieved Technology Readiness Level 6 (TRL-6). Achieving TRL-6 is an important milestone because TRL-6 is required for flight.
Traditionally, focal plane arrays require extensive external focal plane electronics (FPE) to provide clocks and biases as well as to digitize the analog output signals. The FPE has to be well-designed and is typically large, heavy and powerhungry. Most importantly, the FPE has to be placed some distance away from the FPA, which complicates maintaining low noise performance throughout the complete system. To offer an alternative to the discrete electronics, Rockwell Scientific has developed a new approach known as the SIDECAR application-specific integrated circuit (ASIC). This single chip provides all the functionality necessary to operate an infrared array with the convenience of a pure digital interface to the outside world. This paper will present performance data on the latest generation of the SIDECAR ASIC operating the JWST H2RG detector arrays at cryogenic temperature. The test results demonstrate that an ASIC based FPA system will meet or exceed all performance requirements for the JWST mission. The SIDECAR ASIC has been selected by NASA to become the FPA drive electronics for all shortwave infrared instruments on JWST.
The Near-Infrared Spectrograph (NIRSpec) is the James Webb Space Telescope’s primary near-infrared spectrograph. NASA is providing the NIRSpec detector subsystem, which consists of the focal plane array, focal plane electronics, cable harnesses, and software. The focal plane array comprises two closely-butted λco ~ 5 μm Rockwell HAWAII-2RG sensor chip assemblies. After briefly describing the NIRSpec instrument, we summarize some of the driving requirements for the detector subsystem, discuss the baseline architecture (and alternatives), and presents some recent detector test results including a description of a newly identified noise component that we have found in some archival JWST test data. We dub this new noise component, which appears to be similar to classical two-state popcorn noise in many aspects, “popcorn mesa noise.” We close with the current status of the detector subsystem development effort.
This paper discusses the latest technologies for space and ground-based astronomy being pursued by Rockwell Scientific. The discussion covers the latest demonstrated performance of large format NIR (~1.7um cutoff) detectors mated to the HAWAII-2RG readout integrated circuit, our proven readout for large-format arrays for astronomy. Developmental work is presented on the HAWAII-4RG family (consisting of 4k x 4k, 4k x 8k, and 8k x 8k formats), RSC’s newest additions planned to the HAWAII series of astronomy readout integrated circuits. We also present the status of our multifunctional command-and-control ASIC for FPAs, which was first reported at the August 2002 SPIE.
The NIRCam instrument will fly ten of Rockwell Scientific’s infrared molecular beam epitaxy HgCdTe 2048x2048 element detector arrays, each the largest available with current technology, for a total of 40 Megapixels. The instrument will have two varieties of MBE HgCdTe, a SWIR detector with λco = 2.5 μm, for the shortwave channel of NIRCam (0.6-2.3 μm); and a MWIR detector with λco = 5.3 μm, for the longwave channel of NIRCam (2.4-5.0 μm). Demonstrated mean detector dark currents less than 0.01 electrons per second per pixel at operating temperatures below 42 K for the MWIR and below 80 K for the SWIR, combined with quantum efficiency in excess of 80 percent and read noise below 6 electrons rms, make these detector arrays by far the most sensitive SWIR and MWIR devices in the world today. The unique advantages of molecular beam epitaxy as well as FPA data on noise, dark current, quantum efficiency, and other performance metrics will be discussed. In addition, the focal plane assembly package designs will be presented and discussed.
The past 2 to 3 years has been a period of explosive growth in technology development for imaging sensors at Rockwell Scientific Co. (RSC). The state of the art has been advanced significantly, resulting in a number of unique advanced imaging sensor products. A few key examples are: 2048 x 2048 sensor chip assemblies (SCA) for ground and space-based applications, 4096 x 4096 mosaic close-butted mosaic FPA assemblies, a very high performance 10 x 1024 hybridized linear SCA for optical network monitoring and other applications, the revolutionary CMOS ProCam-HD imaging system-on-a-chip for high definition television (HDTV), and RSC's near-infrared emission microscope camera for VLSI defect detection/analysis. This paper provides selected updates of these products and thereby provides an overview of the ongoing highly fertile period of technology and product development at Rockwell Scientific. A view into future directions for advanced imaging sensors is also provided.
The effect of scanning electron microscope (SEM) measurements on the dimensions of resist features was studied for 193nm resist materials. Initial measurements showed that resist lines became smaller as they were repeatedly measured, with size changes of up to 40 to 50 nm after 50 to a 100 measurements. There was a significant size change for the two 193nm resist systems tested, an acrylate based single layer system and a hybrid single layer system, although the magnitude of the effect was different for each system. The total dose per SEM measurement seen locally by the resist was calculated to be on the order of 100 (mu) C/cm$_2), a significant amount by the standards of e-beam induced chemistry. Entire wafers of the hybrid system were cured in an e-beam curing system to enable chemical characterization of irradiated resist. It was found that there was loss of the anhydride functionality when blanket-coated wafers of the hybrid system were cured and a corresponding reduction in film thickness. The remaining material was cross-linked. However, to our surprise, we found that e-beam curing of exposed line and space patterns id not result in any critical dimension (CD) change, any height change, or any profile change. What is more, the cured line and spaces patterns did not show significant line width change when repeatedly measured in a SEM. It is speculated that the resists gets hot while being measured and how hot affects how much shrinkage is seen. Depending on the temperature reached, either cross-linking or annealing will be the fastest process; and the balance between the two will determine how much shrinkage is seen during measurement.
This study evaluates electron beam stabilization of UV6, a positive tone Deep-UV (DUV) resist from Shipley, for a 0.25 micrometer metal etch application. Results are compared between untreated resist and resist treated with different levels of electron beam stabilization. The electron beam processing was carried out in an ElectronCureTM flood electron beam exposure system from Honeywell International Inc., Electron Vision. The ElectronCureTM system utilizes a flood electron beam source which is larger in diameter than the substrate being processed, and is capable of variable energy so that the electron range is matched to the resist film thickness. Changes in the UV6 resist material as a result of the electron beam stabilization are monitored via spectroscopic ellipsometry for film thickness and index of refraction changes and FTIR for analysis of chemical changes. Thermal flow stability is evaluated by applying hot plate bakes of 150 degrees Celsius and 200 degrees Celsius, to patterned resist wafers with no treatment and with an electron beam dose level of 2000 (mu) C/cm2. A significant improvement in the thermal flow stability of the patterned UV6 resist features is achieved with the electron beam stabilization process. Etch process performance of the UV6 resist was evaluated by performing a metal pattern transfer process on wafers with untreated resist and comparing these with etch results on wafers with different levels of electron beam stabilization. The etch processing was carried out in an Applied Materials reactor with an etch chemistry including BCl3 and Cl2. All wafers were etched under the same conditions and the resist was treated after etch to prevent further erosion after etch but before SEM analysis. Post metal etch SEM cross-sections show the enhancement in etch resistance provided by the electron beam stabilization process. Enhanced process margin is achieved as a result of the improved etch resistance, and is observed in reduced resist side-wall angles after etch. Only a slight improvement is observed in the isolated to dense bias effects of the etch process. Improved CD control is also achieved by applying the electron beam process, as more consistent CDs are observed after etch.
As the design rule of device shrinks below 0.14 micrometer, the higher resolution is required for real device application. With smaller feature size below 0.14 micrometer, the lower coating thickness of resist is essential because of the pattern collapse issue at the high aspect ratio. However, the lower resist thickness induces the problem of etch selectivity due to the limited etch resistance of resist. In this study, the method of electron beam stabilization has been applied for improving the etch selectivity of resist patterns having an aspect ratio less than 3:1. With applying the electron beam stabilization, the Deep-UV photoresists based on the chemical structures of Acetal (AS106) and Escap (UV82) types have been evaluated in the respect of etch selectivity as the functions of an electron beam dose and etch condition. The metal etch rate reductions of 20 percent and 26 percent have been occurred for the resists of Acetal and Escap type, respectively, at 2000 (mu) C/cm2. And the thermal and chemical properties were characterized before and after electron beam stabilization using DSC, TGA, and FT-IR. The cross-sectional views of resist pattern after electron beam processing were also investigated to know the chemical stability of resist during the electron beam process. Based on the experimental results, the application possibility of electron beam stabilization for real device fabrication below 0.14 micrometer has been presented in this paper.
With the integration of high current ion implant processing into volume CMOS manufacturing, the need for photoresist stabilization to achieve a stable ion implant process is critical. This study compares electron beam stabilization, a non-thermal process, with more traditional thermal stabilization techniques such as hot plate baking and vacuum oven processing. The electron beam processing is carried out in a flood exposure system with no active heating of the wafer. These stabilization techniques are applied to typical ion implant processes that might be found in a CMOS production process flow. The stabilization processes are applied to a 1.1 micrometers thick PFI-38A i-line photoresist film prior to ion implant processing. Post stabilization CD variation is detailed with respect to wall slope and feature integrity. SEM photographs detail the effects of the stabilization technique on photoresist features. The thermal stability of the photoresist is shown for different levels of stabilization and post stabilization thermal cycling. Thermal flow stability of the photoresist is detailed via SEM photographs. A significant improvement in thermal stability is achieved with the electron beam process, such that photoresist features are stable to temperatures in excess of 200 degrees C. Ion implant processing parameters are evaluated and compared for the different stabilization methods. Ion implant system end-station chamber pressure is detailed as a function of ion implant process and stabilization condition. The ion implant process conditions are detailed for varying factors such as ion current, energy, and total dose. A reduction in the ion implant systems end-station chamber pressure is achieved with the electron beam stabilization process over the other techniques considered. This reduction in end-station chamber pressure is shown to provide a reduction in total process time for a given ion implant dose. Improvements in the ion implant process are detailed across several combinations of current and energy.
This study investigates resist stabilization techniques as they are applied to a metal etch application. The techniques that are compared are conventional deep-UV/thermal stabilization, or UV bake, and electron beam stabilization. The electron beam tool use din this study, an ElectronCure system from AlliedSignal Inc., ELectron Vision Group, utilizes a flood electron source and a non-thermal process. These stabilization techniques are compared with respect to a metal etch process. In this study, two types of resist are considered for stabilization and etch: a g/i-line resist, Shipley SPR-3012, and an advanced i-line, Shipley SPR 955- Cm. For each of these resist the effects of stabilization on resist features are evaluated by post-stabilization SEM analysis. Etch selectivity in all cases is evaluated by using a timed metal etch, and measuring resists remaining relative to total metal thickness etched. Etch selectivity is presented as a function of stabilization condition. Analyses of the effects of the type of stabilization on this method of selectivity measurement are also presented. SEM analysis was also performed on the features after a compete etch process, and is detailed as a function of stabilization condition. Post-etch cleaning is also an important factor impacted by pre-etch resist stabilization. Results of post- etch cleaning are presented for both stabilization methods. SEM inspection is also detailed for the metal features after resist removal processing.
With the integration of high energy ion implant processes into volume CMOS manufacturing, the need for thick resist stabilization to achieve a stable ion implant process is critical. With new photoresist characteristics, new implant end station characteristics arise. The resist outgassing needs to be addressed as well as the implant profile to ensure that the dosage is correct and the implant angle does not interfere with other underlying features. This study compares conventional deep-UV/thermal with electron beam stabilization. The electron beam system used in this study utilizes a flood electron source and is a non-thermal process. These stabilization techniques are applied to a MeV ion implant process in a CMOS production process flow.
In the manufacture of many types of integrated circuit and thin film devices, it is desirable to use a lift-of process for the metallization step to avoid manufacturing problems encountered when creating metal interconnect structures using plasma etch. These problems include both metal adhesion and plasma etch difficulties. Key to the success of the lift-off process is the creation of a retrograde or undercut profile in the photoresists before the metal deposition step. Until now, lift-off processing has relied on costly multi-layer photoresists schemes, image reversal, and non-repeatable photoresist processes to obtain the desired lift-off profiles in patterned photoresist. This paper present a simple, repeatable process for creating robust, user-defined lift-off profiles in single layer photoresist using a non-thermal electron beam flood exposure. For this investigation, lift-off profiles created using electron beam flood exposure of many popular photoresists were evaluated. Results of lift-off profiles created in positive tone AZ7209 and ip3250 are presented here.
KEYWORDS: Electron beams, Photoresist processing, Photoresist materials, Statistical analysis, FT-IR spectroscopy, Chemical analysis, Scanning electron microscopy, Picture Archiving and Communication System, Refraction, Thin films
For a range of thick film photoresist applications, including MeV ion implant processing, thin film head manufacturing, and microelectromechanical systems processing, there is a need for a low-temperature method for resist stabilization and curing. Traditional methods of stabilizing or curing resist films have relied on thermal cycling, which may not be desirable due to device temperature limitations or thermally-induced distortion of the resist features.
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