This paper presents a method for etching millimetre-deep trenches in commercial grade PMMA using deep-UV
at 254 nm. The method is based on consecutive cycles of irradiation and development of the exposed areas, respectively.
The exposure segment is performed using an inexpensive, in-house built irradiation box while the development part is
accomplished using an isopropyl alcohol (IPA):H2O developer. The method was tested and characterized by etching
various dimension square test structures in commercial grade, mirrored acrylic. The undercut of the sidewalls due to the
uncollimated nature of the irradiation light was dramatically alleviated by using a honeycomb metallic grid in between
the irradiation source and the acrylic substrate and by rotating the latter using a direct current (DC) motor-driven stage.
By using an extremely affordable set-up and non-toxic, environmentally friendly materials and substances, this process
represents an excellent alternative to microfabricating microfluidic devices in particular and high aspect ratio structures
in general using PMMA as substrate.
Poly(dimethylglutarimide) (PMGI) is a resist that is commonly used in bilayer and trilayer imaging applications. PMGI can be exposed using various radiation sources including deep UV. Currently, there are only two developers for PMGI reported in the literature: tetramethylammonium hydroxide and tetraethylammonium hydroxide. We introduce a new developer for PMGI, a mixture of isopropanol (IPA) and water. Samples were irradiated with deep UV at 254 nm. The IPA/water developer exhibits rapid dissolution of exposed PMGI, of many microns per minute. However, PMGI exhibits high absorption at 254 nm, so the development depth is limited. The depth limit, after a critical dose, increases linearly with the exposure dose.
Polydimethylglutarimide PMGI-based resists are finding increasing
use in microelectromechanical systems MEMS as both sacrificial
and structural materials. PMGI-based resists are commercially
available and were originally designed for use in bilayer lift-off applications.
Literature on deep-UV exposure and development of PMGI films is
limited to films less than 2.5 m in thickness, and use only tetramethylammonium
hydroxide TMAH-based developers. We investigate the
exposure and development of PMGI films greater than 6 m in thickness
using the two main classes of developer for PMGI, TMAH, and tetraethylammonium
hydroxide TEAH-based developers. At these thicknesses,
a nonuniform dose through the film due to the optical absorption of the
PMGI leads to large gradients in the dissolution properties. We report
etch rates as a function of surface dose and development time. Additionally
a model is developed to provide a basic predictor of development
depth and other important data for fabrication process planning and
development.
We are currently developing basic building blocks for creating digital logic units that are based on mechanical components. Transistors, which are semiconductor devices, rely on doping to change intrinsic semiconductor to extrinsic semiconductors. However, at low or high temperatures, that control is impossible as semiconductors revert to intrinsic behaviour. Also, semiconductors exhibit various complications under ionizing (radiation) environment.
We have fabricated logic units using micro-mechanical relays using MEMS technology. The logic units consist of a micro-mechanical relay with three electrical gates. The mechanical relay is fabricated with a cantilever over an airgap, and is operated by applying voltage to the gate. The applied voltage creates an electric force between the gate and a cantilever structure. The electrostatic force arches the cantilever into electrical contact. Since the operation does not depend on controlling the type of charge carriers, the proposed method does not suffer from the limitations shared by semiconductors. With different input combinations applied to the gates of the device, development of MEMS mechanical logic, leading to general digital circuits, is possible. Characterization of the devices is performed, which includes operation times, operation voltages, and maximum
currents. Design, fabrication and testing of these micro-mechanical logic elements will be presented in the paper.
Microsystems often require switches or mechanisms to provide two stable states. In answer to this need, we design a novel micromechanical bistable switch based on the locking mechanism commonly used in extension ladders. This switch was designed and fabricated through the multiuser MEMS processes (MUMPs). Actual performance of the switch was videotaped, analyzed, and compared with theory and simulation. This design was fully functional on the first design iteration, and can easily be extended to provide multiple stable states. We outline the design, simulation, and results from the testing of the microfabricated system.
We present an extension to the ray-transfer matrix method, which is often used to characterize optical systems. The main purpose of the extended method is to model micro-optical-bench systems that are usually manufactured using surface micromachining and other microfabrication technologies. Using a homogeneous coordinate system to extend standard ray-transfer matrices allows the matrix notation to account for manufacturing tolerances. As an example of this method's usefulness, we calculate the coupling losses in a surface micromachined fiber-optic switch.
The paper extends the work done using micro-fabricated hinges in surface micromachining to create fully 3D devices. These devices include free-space micro-optic systems and various sensors. While these applications are interesting, the assembly process is difficult. We present the basic theory and process necessary to perform the assembly using electrostatic interactions. The process is easy and reliable. We were able to lift early prototype mirrors with voltages as low as 35 volts.
SC236: Polysilicon Surface Micromachine Technology and Devices
This course is designed to introduce newcomers to micromachining technology and concepts as well as those with a basic familiarity with integrated circuit manufacturing technology about the emerging field of Micro Electro Mechanical Systems (MEMS). Both manufacturing technologies for these devices and examples of sensor and actuator devices will be presented. The course focuses on polysilicon surface micromachining, but will also include a brief overview of other MEMS manufacturing technologies and devices.
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