Dr. Peter Weidner Profile

Dr. Peter Weidner

at Qimonda Dresden GmbH & Co OHG

SPIE Involvement:

Author

Publications (4)

Proceedings Article | 3 October 2008 Paper

Model-free and model-based methods for dimensional metrology during the lifetime of a product

Peter Weidner, Alexander Kasic, Thomas Hingst, Carsten Ehlers, Sylke Philipp, Thomas Marschner, Manfred Moert

Proceedings Volume 7155, 71550Y (2008) https://doi.org/10.1117/12.814534

KEYWORDS: Semiconducting wafers, Scatterometry, Model-based design, Dimensional metrology, Atomic force microscopy, Infrared radiation, Metrology, Critical dimension metrology, Thermal modeling, High volume manufacturing

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Proceedings Article | 24 May 2004 Paper

Improved etch and CMP process control using in-line AFM

Thomas Trenkler, Thomas Kraiss, Ulrich Mantz, Peter Weidner, Rebecca Pinto

Proceedings Volume 5375, (2004) https://doi.org/10.1117/12.535967

KEYWORDS: Atomic force microscopy, Chemical mechanical planarization, Capacitors, Process control, Etching, Semiconducting wafers, Phase modulation, Metrology, Scanning electron microscopy, Oxides

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Proceedings Article | 24 May 2004 Paper

Infrared spectroscopic ellipsometry in semiconductor manufacturing

Pierre-Yves Guittet, Ulrich Mantz, Peter Weidner, Jean-Louis Stehle, Marc Bucchia, Sophie Bourtault, Dorian Zahorski

Proceedings Volume 5375, (2004) https://doi.org/10.1117/12.533935

KEYWORDS: 3D modeling, Infrared spectroscopy, Semiconducting wafers, Infrared radiation, Silicon, Spectroscopic ellipsometry, Metrology, Mid-IR, Reflection, Scanning electron microscopy

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Proceedings Article | 24 May 2004 Paper

Spectroscopic ellipsometry-based scatterometry for depth and linewidth measurements of polysilicon-filled deep trenches

Thomas Hingst, Manfred Moert, Peter Reinig, Elke Backen, Rene Dost, Peter Weidner, John Hopkins, Ted Dziura, Assim Elazami, Regina Freed

Proceedings Volume 5375, (2004) https://doi.org/10.1117/12.535646

KEYWORDS: Scatterometry, Oxides, Atomic force microscopy, Semiconducting wafers, 3D metrology, Silicon, Process control, Scatter measurement, 3D modeling, Etching

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