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Kota Dobashi
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Publications (1)
Proceedings Article | 10 April 2024 Poster + Paper
High-accuracy wafer topography sensor using optical spectroscopy and correction based on an optical model
Proceedings Volume 12955, 1295525 (2024) https://doi.org/10.1117/12.3009791
KEYWORDS: Semiconducting wafers, Optical sensors, Film thickness, Wafer bonding, Optical alignment, Deformation, Sensors
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