In a silicon Mach-Zehnder modulator with on-chip termination, the reflection of the driving signal in the traveling wave electrode often occurs due to non-ideal factors. This may influence the modulating signal characteristics. To study such influence, the S11 response of the electrode is averaged over different frequency ranges to characterize the reflection of the driving signal in the electrode. We find that the signal-to-noise ratio and the jitter can be substantially affected by the reflection. In addition, for the same characteristic, when the averaging frequency range for S11 varies, the relations between mean S11 and the output signal characteristics may also vary to some extent. Understanding of these phenomena are potentially useful to the applications of the modulators in the optical communication systems.
For 1xnm node and beyond, even Extreme Ultraviolet Lithography (EUV) technology, the serious geometries distortions of the wafer patterns at new process are forcing chipmakers and foundries to utilize model-based SRAFs for ensuring the accuracy and manufacturability of the chips. Model-based Sub-Resolution Assistant Feature (SRAF) is based on inverse lithography (ILT), which is accurate but time-consuming. Therefore, it is necessary to extract the SRAF rules from model-based results and apply them to full chip layout. In this paper, we put forward a methodology of 2D SRAF rule extraction based on model-based results. We can describe and locate the SRAFs by introducing Projection Region, because it reflect the relationship between the SRAFs and main patterns. And the new concept Elongation can make the properties of SARFs more clearly. The experimental results show that the proposed method can extract the 2D SRAFs accurately and output the rules in a general format. The rule simplifying step can decrease the quantity of 2D SRAF rules through the identification and process of symmetry.
The oblique incidence of the illumination system in EUV lithography combined with relative thick absorber layer of EUV mask introduces many unique distortions on the image transfer between mask and wafer, most of these distortions are non-linear thus makes the enhancement of resolution more difficult. This paper focus on analysing the impacts of the absorber layer thickness, multilayer thickness and the light source morphology on the image. And improve the EUV lithography and imaging quality by co-optimization of these three parameters. Besides, the intrinsic features and rules of the impacts of absorber thickness on the imaging properties is revealed. And the different behaviour of 1D dense pattern and isolation pattern during the co-optimization is analysed and elucidated. This study provides a potential new direction for resolution enhancement technology.
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