Prof. Jack K. Luo Profile

Prof. Jack K. Luo

at Univ of Bolton

SPIE Involvement:

Author

Proceedings Article | 9 August 2013 Paper

Sensors based on SAW and FBAR technologies

L. García-Gancedo, W. Milne, J. Luo, A. Flewitt

Proceedings Volume 8793, 879308 (2013) https://doi.org/10.1117/12.2022205

KEYWORDS: Zinc oxide, Lab on a chip, Acoustics, Sensors, Microfluidics, Sputter deposition, Resonators, Thin films, Silicon, Crystals

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Proceedings Article | 25 April 2008 Paper

Feasibility study for a MEMS modulator suitable for optical system network signalling

P. Mitchell, R. Jackson, J. Luo

Proceedings Volume 6993, 69930I (2008) https://doi.org/10.1117/12.779113

KEYWORDS: Microelectromechanical systems, Actuators, Modulators, Optical networks, Transmitters, Networks, Finite element methods, Optical modulators, Modulation, 3D modeling

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Proceedings Article | 18 February 2008 Paper

Degradation evaluation of microelectromechanical thermal actuators

J. K. Luo, Y. Q. Fu, Q. A. Huang, J. Williams, W. Milne

Proceedings Volume 6884, 688405 (2008) https://doi.org/10.1117/12.760918

KEYWORDS: Microactuators, Nickel, Actuators, Silicon, Microelectromechanical systems, Metals, Scanning electron microscopy, Oxygen, Resistance, Oxidation

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Proceedings Article | 15 May 2007 Paper

DLC/TiNi microcage for biopsy applications

Y. Q. Fu, J. K. Luo, S. Ong, S. Zhang, A. J. Flewitt, W. I. Milne

Proceedings Volume 6589, 65891C (2007) https://doi.org/10.1117/12.721564

KEYWORDS: Thermal effects, Shape memory alloys, Silicon, Microelectromechanical systems, Biopsy, Thin films, Tissues, Coating, Etching, Image transmission

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Proceedings Article | 6 January 2006 Paper

A critical comparison and development of nano-mechanical characterization of MEMS/NEMS thin film materials

Johnny He, H. Le, J. Luo, Y. Fu, D. Moore

Proceedings Volume 6111, 61110T (2006) https://doi.org/10.1117/12.647295

KEYWORDS: Thin films, Microelectromechanical systems, Diamond, Silicon, Profilometers, Silicon carbide, Nickel, Silicon films, Etching, Low pressure chemical vapor deposition

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Proceedings Article | 1 July 2005 Paper

Large displacement spring-like electro-mechanical thermal actuators with insulator constraint beams

J. K. Luo, Y. Q. Fu, A. J. Flewitt, S. M. Spearing, N. A. Fleck, W. I. Milne

Proceedings Volume 5836, (2005) https://doi.org/10.1117/12.608299

KEYWORDS: Actuators, Etching, Silicon, Instrument modeling, Nickel, Finite element methods, Modeling, Photoresist materials, Performance modeling, Device simulation

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Proceedings Article | 1 July 2005 Paper

MEMS/NEMS mechanical characterization on different thin film materials by scanning along micro-machined cantilevers

J. H. He, J. K. Luo, H. R. Le, D. F. Moore

Proceedings Volume 5836, (2005) https://doi.org/10.1117/12.608710

KEYWORDS: Silicon, Nickel, Thin films, Profilometers, Etching, Error analysis, Calibration, Statistical analysis, Finite element methods, Microelectromechanical systems

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Proceedings Article | 1 July 2005 Paper

TiNi shape memory alloy based micropumps

Y. Q. Fu, J. K. Luo, M. Hu, H. J. Du, A. Flewitt, W. Milne

Proceedings Volume 5836, (2005) https://doi.org/10.1117/12.608506

KEYWORDS: Silicon, Shape memory alloys, Microelectromechanical systems, Etching, Thin films, Silicon films, Actuators, Semiconducting wafers, Composites, Microfluidics

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SPIE Journal Paper | 1 April 2005

Development of all metal electrothermal actuator and its applications

Jack Luo, J. H. He, Andrew Flewitt, David Moore, S. Mark Spearing, Norman Fleck, William Milne

JM3, Vol. 4, Issue 02, 023012, (April 2005) https://doi.org/10.1117/12.10.1117/1.1898243

KEYWORDS: Actuators, Nickel, Metals, Plating, Microelectromechanical systems, Temperature metrology, Silicon, Resistance, Thin films, Scanning electron microscopy

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Proceedings Article | 28 February 2005 Paper

Micromirror structure based on TiNi shape memory thin films

Yong Qing Fu, Min Hu, Hejun Du, Jack Luo, Andrew Flewitt, William Milne

Proceedings Volume 5649, (2005) https://doi.org/10.1117/12.567317

KEYWORDS: Micromirrors, Silicon, Electrodes, Mirrors, Etching, Thin films, Microelectromechanical systems, Temperature metrology, Semiconducting wafers, Beam shaping

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