The European H2020-SPACE-ORIONAS project targets the development of optical transceiver and amplifier integrated circuits and modules applicable to high-speed and compact laser communication terminals. This paper presents the most recent project achievements in two areas. Firstly, the fabrication of high-speed electronic-photonic modulator and receiver circuits monolithically integrated in the silicon photonics platform and their assembly in bread-board level photonic modules. Secondly, the assembly, integration and testing of a radiation resistant, high-gain optical fiber preamplifier which exploits hi-rel small form factor fiber optics to shrink the module mass and footprint.
H2020-SPACE-ORIONAS is a 3-year Research and Innovation Action program funded by the European Commission focusing on the development of compact optical transceiver and amplifier modules applicable to new generation optical inter-satellite links. ORIONAS explores photonic integrated circuits and small form factor fiber optics leveraging their success in datacenter interconnect and hi-rel aerospace applications to deliver miniaturized modules and devices that can shrink considerably the SWaP of lasercom terminals. This paper presents the most recent project achievements.
The EU-SIPhoDiAS project deals with the development of critical photonic building blocks needed for highperformance and low size, weight, and power (SWaP) photonics-enabled Very High Throughput Satellites (VHTS). In this presentation, we report on the design and fabrication activities during the first year of the project concerning the targeted family of digital and microwave photonic components. This effort aims to demonstrate components of enhanced reliability at technology readiness level (TRL) 7. Specifically, with respect to microwave photonic links, we report: (i) the design of Ka and Q-bands analogue photodetectors that will be assembled in compact packages, allowing for very high bandwidth per unit area and (ii) on the design of compact V-band GaAs electro-optic modulator arrays, which use a folded-path optical configuration to manage all fiber interfaces packaged opposite direct in-line RF feeds for ease of board layouts and mass/size benefits. With respect to digital links, we report on the development of 100 Gb/s (4 x 25 Gb/s) digital optical transceiver sub-assemblies developed using flip-chip mounting of electronic and opto-parts on a high-reliability borosilicate substrate. The transceiver chipset developed specifically for this project refers to fullycustom 25 Gb/s radiation hard (RH) VCSEL driver and TIA ICs designed in IHP’s 130 nm SiGe BiCMOS Rad-Hard process.
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