Lynred is leading the development of infrared detectors for high performances applications. Two trends are identified in the infrared range, the increase of the operating temperature and the pixel pitch reduction. For 15 years, the III-V technologies present an increasing interest to address both challenges. At LYNRED, these technologies allow to address Short Wave InfraRed (SWIR) and Mid-Wave InfraRed (MWIR) for ground applications. Many challenges have to be addressed for the future focal plane arrays (FPAs). Electrical and optical crosstalks as well as image quality and stability, are one of the prime concern for detectors with pixel pitch down to 7.5μm. In order to reach an industrial production level of infrared FPAs, technological developments are required at each steps: the epitaxy, the detector array process, flip chip and back end processing. Another key element is the Read Out Integrated Circuit (ROIC) designed in-house to fulfil our customer needs.
We review the latest developments at LYNRED on III-V technologies, in terms of operability, residual fixed pattern noise (RFPN) and Modulation Transfer Function (MTF) optimizations.
LYNRED is a leading global provider of high-quality II-VI, III-V and bolometers infrared detectors for the aerospace, defence and commercial markets. Our vision is to preserve and protect, and provide the right technology to customers’ needs. To consolidate our position among infrared detector manufacturer leaders and to enable us to respond to growing market demand for next-generation infrared technologies, a new state of the art industrial facility is breaking ground. This new industrial site named Campus will double the current cleanroom footprint and increase production capacity with optimal cleanliness classification for new high-performance products.
Among these next generations technologies, Campus will serve the ongoing developments of sub-10μm pitch cooled infrared detectors, MCT HOT technology, for extended MW band and III-V HOT MW blue band technology.
We will discuss in this paper the true figures of merit that have to be addressed during technology development and optimization to meet field mission requirements. We will then review latest results on II-VI and III-V HOT IDDCA (Integrated Detector Dewar Cryocooler Assembly) with 7.5μm pitch SXGA format focal plane array in terms of low frequency noise defects, stability and reproducibility of residual fixed pattern noise (RFPN) and Modulation Transfer Function (MTF) optimizations while maintaining high quantum efficiency to keep highest possible range.
LYNRED is oriented towards excellence in II-VI, III-V and bolometers technologies, covering all Society’s needs in term of infrared detection. Our vision is to preserve and protect, and more than ever, our goal is to provide the right technology to the field missions, spatial and industrial applications, and more generally the right technology to customers’ needs. For this purpose we are developing for the next generation pitch, MCT HOT technology, for extended MW band as well as III-V HOT MW blue band technology. Many challenges have to be addressed for future small pitch, large format and HOT detectors. Electrical and optical crosstalks as well as image quality and stability, are one of the prime concern for detectors with pixel pitch below 10μm. We will discuss about the trade-off between the different material properties and detector performances to ensure mandatory minimization of Minimum Resolvable Temperature Difference (MRTD) for range optimization. We will then review latest 7.5μm pitch development at LYNRED, with SXGA formats, based on II-VI and III-V HOT materials, in terms of operability, residual fixed pattern noise (RFPN) and Modulation Transfer Function (MTF) optimizations.
The short wave infrared (SWIR) spectral band is an emerging domain thanks to its large potential. Close to VISible/Near Infrared wavelengths, SWIR images interpretation is made easier for the users. In this spectral region, new opportunities can be found in several fields of applications such as defense and security (night vision, active imaging), space (earth observation), transport (automotive safety), or industry (nondestructive process control, food and plastic sorting). In the frame of this paper, the development of a small pitch InGaAs technology for the SWIR band is described. The objective is to fuel an increase in focal plane arrays (FPA) resolution with the development of a10μm pitch process. A specific Read Out Integrated Circuit (ROIC) has been designed to address a high frame rate and various functions like the selection of lines or specific windowing. The ROIC exhibits 3 different gains. A full set of electro-optical characterizations for a VGA 10μm pitch focal plane array is presented.
The short wave infrared (SWIR) spectral band is an emerging domain thanks to its large potential. Close to VISible/Near Infrared wavelengths, SWIR images interpretation is made easier for the users. In this spectral region, new opportunities can be found in several fields of applications such as defense and security (night vision, active imaging), space (earth observation), transport (automotive safety), or industry (nondestructive process control, food and plastic sorting). In the frame of this paper, two different developments of the InGaAs technology addressing emerging fields of SWIR imaging are described: pixel pitch reduction and multi-spectral imaging. In pixel pitch reduction the obvious objective is to increase the imaging resolution without jeopardizing system cost. Multi-spectral resolution deals, on the other hand, with interposition of pixelated filters in the optical path right onto SWIR focal plane arrays (FPA) to enable a real time spectral analysis of recorded SWIR images.
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