Mr. Geoffroy Dumont Profile

Geoffroy Dumont

at MINATEC

SPIE Involvement:

Author

Publications (9)

Proceedings Article | 7 June 2024 Presentation + Paper

FDSOI transistor-based uncooled microbolometer: demonstration of a 12µm pixel sensitive to IR flux

A. Albouy, G. Dumont, M. Le Cocq, C. Vialle, R. M. Kubica, L. Carle, V. Goudon, T. Perrillat-Bottonet, J. J. Yon, P. Leduc

Proceedings Volume 13046, 130460Z (2024) https://doi.org/10.1117/12.3013449

KEYWORDS: Microbolometers, Transistors, Transducers, Thermography, Semiconducting wafers, Scanning electron microscopy, Matrices, CMOS devices, Standards development, Absorption

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Proceedings Article | 24 June 2014 Paper

Latest improvements in microbolometer thin film packaging: paving the way for low-cost consumer applications

J. Yon, G. Dumont, V. Goudon, S. Becker, A. Arnaud, S. Cortial, C. Tisse

Proceedings Volume 9070, 90701N (2014) https://doi.org/10.1117/12.2050378

KEYWORDS: Microbolometers, Packaging, Staring arrays, Semiconducting wafers, Bolometers, Infrared sensors, Thermography, Thin films, Infrared radiation, Electroluminescence

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Proceedings Article | 27 March 2013 Paper

Technological customization of uncooled amorphous silicon microbolometer for THz real time imaging

S. Pocas, E. Deronzier, P. Brianceau, P. Imperinetti, G. Dumont, A. Roule, W. Rabaud, J. Meilhan, F. Simoens, V. Goudon, Claire Vialle, A. Arnaud

Proceedings Volume 8624, 862419 (2013) https://doi.org/10.1117/12.2001259

KEYWORDS: Terahertz radiation, Copper, Semiconducting wafers, Oxides, Etching, Microbolometers, Real time imaging, Bolometers, Antennas, Amorphous silicon

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Proceedings Article | 24 October 2012 Paper

320 x 240 uncooled IRFPA with pixel wise thin film vacuum packaging

J-J. Yon, G. Dumont, W. Rabaud, S. Becker, L. Carle, V. Goudon, C. Vialle, A. Hamelin, A. Arnaud

Proceedings Volume 8541, 85410D (2012) https://doi.org/10.1117/12.974846

KEYWORDS: Microbolometers, Packaging, Semiconducting wafers, Infrared radiation, Infrared sensors, Sensors, Bolometers, Resistance, Thin films, Staring arrays

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Proceedings Article | 31 May 2012 Paper

Current progress on pixel level packaging for uncooled IRFPA

G. Dumont, W. Rabaud, J.-J. Yon, L. Carle, V. Goudon, C. Vialle, Sébastien Becker, Antoine Hamelin, A. Arnaud

Proceedings Volume 8353, 83531I (2012) https://doi.org/10.1117/12.919918

KEYWORDS: Bolometers, Resistance, Packaging, Microbolometers, Semiconducting wafers, Imaging devices, Infrared imaging, Infrared sensors, Measurement devices, Thermography

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Proceedings Article | 21 May 2011 Paper

Pixel level packaging for uncooled IRFPA

G. Dumont, W. Rabaud, X. Baillin, JL. Pornin, L. Carle, V. Goudon, C. Vialle, M. Pellat, A. Arnaud

Proceedings Volume 8012, 80121I (2011) https://doi.org/10.1117/12.883852

KEYWORDS: Packaging, Bolometers, Thin films, Microbolometers, Etching, Resistance, Semiconducting wafers, Scanning electron microscopy, Reflectors, Reflectivity

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Proceedings Article | 27 October 2010 Paper

Recent development in pixel level packaging for uncooled IRFPA

W. Rabaud, G. Dumont, X. Baillin, L. Carle, E. Lagoutte, M. Pellat, V. Goudon, C. Vialle, A. Arnaud

Proceedings Volume 7834, 78340T (2010) https://doi.org/10.1117/12.868462

KEYWORDS: Thin films, Etching, Packaging, Bolometers, Reflectivity, Scanning electron microscopy, Reflectors, Semiconducting wafers, Resistance, Temperature metrology

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Proceedings Article | 17 April 2008 Paper

Innovative on-chip packaging applied to uncooled IRFPA

Geoffroy Dumont, Agnès Arnaud, Pierre Impérinetti, Claire Vialle, Wilfried Rabaud, Valérie Goudon, Jean-Jacques Yon

Proceedings Volume 6940, 69401Y (2008) https://doi.org/10.1117/12.780433

KEYWORDS: Microbolometers, Packaging, Bolometers, Etching, Sensors, Absorption, Resistance, Thin films, Infrared sensors, Amorphous silicon

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Proceedings Article | 24 January 2008 Paper

Innovative on-chip packaging applied to uncooled IRFPA

Geoffroy Dumont, Agnès Arnaud, Pierre Imperinetti, Eric Mottin, François Simoens, Claire Vialle, Wilfried Rabaud, Gilles Grand, Nathalie Baclet

Proceedings Volume 6835, 68350G (2008) https://doi.org/10.1117/12.756719

KEYWORDS: Microbolometers, Packaging, Etching, Sensors, Amorphous silicon, Absorption, Bolometers, Germanium, Zinc, Scanning electron microscopy

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Showing 5 of 9 publications

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