The dosimeters based on RADFETs are high actual for utilizing in space where the low dose rates irradiation prevails. The paper presents new experimental data on low-intensity irradiation of p-MNOS based RADFET. The obtained results were compared with the results of irradiation at high dose rates. The effect of ELDRS and the simultaneous annealing effect on different types of samples were discussed. The sensitivity of both types changed similarly at the range 1-100 rad(Si)/s. However, for dose rates less than 1 rad(Si)/s, the effect of the simultaneous annealing on change in the threshold voltage shift in time was clearly noticed only for samples with 500 nm oxide and absented for samples with 150 nm oxide.
We use a linear approximation for the threshold voltage dependence on the body bias to derive the equation for the equivalent output resistance of the “extrinsic” MOSFET in the saturation regime. Previously we derived an equation for the equivalent output resistance of the “extrinsic” MOSFET in the saturation regime, that is based on the “intrinsic” transistor finite output resistance in the saturation regime. But we did not account for the body effect, i.e., the threshold voltage dependence on the body bias applied between the source and the fourth (body) MOSFET terminal. For the earlier generations of MOSFETs, the theory predicts that threshold voltage is a sublinear function of the body bias. However, modern transistors with steep retrograde body doping profiles exhibit an approximately linear relationship between a threshold voltage and a body bias, which allowed us to include the body effect into the compact model of an “extrinsic MOSFET. In addition, we discuss the application of our results to the theory of a common-source amplifier with an NMOS transistor with source degeneration.
We demonstrate in this paper some applications of a general approach for constructing field-effect transistor compact models based on decomposing of FET modeling into two independent parts: device electrostatics and continuity equation. While the latter part has a universal form for any field-effect devices, the electrostatics is specific for different types of transistors which is expressed in different dependencies of the channel charge density upon gate voltage. We discuss here two applications of this approach using the examples of Schottky barrier MESFETs and organic field-effect transistors.
We derived the equation for the drain current of a short-channel MOSFET with nonzero differential conductance in saturation regime describing its nonlinear dependence on “extrinsic” drain bias and accounting for the parasitic and contact series resistances. This implicit equation could be numerically solved in the entire range of the drain biases. We have also derived the equation for the differential conductance of the “extrinsic” MOSFET in the saturation regime. Finally, we have proposed a linear approximation for asymptotic dependence of the “extrinsic” MOSFET drain current on “extrinsic” drain bias in saturation regime.
We simulated in this work the electrical characteristics of p-MNOS based dosimeters before and after irradiation. The parameters of dose sensitivity for the samples irradiated in the different electric modes of operation were obtained. A good agreement between simulation and the measurement results was shown.
KEYWORDS: Visualization, Ions, Radiation effects, Data modeling, Particles, Magnesium, Electronics, Energy transfer, Nanoelectronics, Current controlled current source
In this paper based on the new parameterization shape, an alternative heavy ion induced soft errors characterization approach is proposed and validated. The method provides an unambiguous calculation procedure to predict an upset rate in highly-scaled memory in a space environment.
In this article, we have studied the influence of Si3N4 and SiO2 thin film gate dielectrics on the current-voltage characteristics of the graphene-based transistor. The test structure of graphene transistor was fabricated with the top and back gate. Graphene has been produced by chemical vapor deposition, and then transferred to the silicon dioxide on a silicon wafer. The channel of the transistor has been formed by etching in oxygen plasma through a photolithographic mask. Metals electrodes of the drain, source, and gate were deposited by resistive evaporation in a vacuum. It was used titanium / aluminum with a thickness of 50/200 nm. In the case of the back gate, silicon dioxide was used, obtained by thermal oxidation of the silicon substrate. For top gate was used silicon nitride deposited by plasma chemical deposition. It was demonstrated that field effect is more pronounced for the case of SiO2 back gate compare to the Si3N4 top gate. For the SiO2 back gate we have observed that the source- drain current decreases, from 2 mA to 3 mA, with increasing the gate voltage, from 0 to 40 V, at constant source-drain voltage, 2 V. In case of Si3N4 top gate the modulation of source-drain current was not significant for the comparable electric field strength. Based on the value of gate voltage for current minima in transfer function the poor quality of Si3N4 –graphene interface is concluded.
We propose a Verilog-A modeling concept for modern bulk and SOI FinFETs TID sensitivity modeling. The concept allows to model the fin width and length dependencies of TID sensitivity.
It is shown that observed non-monotonic behavior of dose degradation in bipolar devices can be explained within the non-linear set of kinetic equations for the oxide trapped charge and surface recombination centers. It has been shown that proposed earlier a physical model of the Enhanced Low Dose Rate Sensitivity (ELDRS) is fully consistent with experimental temperature dependence of charge yield in thick oxides for a range of low temperatures.
Destructive single event gate rupture (SEGR) occurring in the gate oxides of power MOSFETs under impact of heavy ions is studied and modeled. SEGR cross section of power MOSFET with 70 nm oxide thickness as function of gate voltage was measured for four types of heavy ions. A predictive formula for the SEGR cross section is derived and validated. This formula can be used as a predictive instrument for computation of survival probability in a given spectrum of heavy ions in space environments.
KEYWORDS: Monte Carlo methods, Ions, Transistors, Oxides, Silicon, X-rays, Information operations, Power supplies, Error analysis, Field programmable gate arrays
We study the Radiation-Induced Mismatch Enhancement (RIME) in 65 nm CMOS SRAM block designed for space applications. X-ray and heavy ion irradiation increase the number of non-rewriting cells.
A general approach to derive the current-voltage characteristics both for field-effect and bipolar transistors has been proposed based on exact solution of current continuity equation in diffusion-drift approximation taking into account nonuniformity of electric field and charge density distributions between the contacts. This approach describes in a unified manner both linear and saturation parts of MOSFET’s I-V characteristics as for velocity saturation and for electrostatic pinch-off effect cases. It was shown also that the same design formula is appropriate for description of I-V characteristics in bipolar transistors.
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