The nanostructuring on titanium surfaces is studied by low-energy argon ion irradiation. The surfaces are analysed by EBSD for grain orientation mapping, SEM for surface imaging, WLI and AFM for topography characterization, XPS and ToF-SIMS for chemical surface analysis. Under normal incidence specific nanoripple structures are formed, whereas the morphology is defined by the crystallographic conditions only. A characteristic relation between grain orientation and ripple size is elaborated. Experiments on co-deposition with Al, C, Cu, Fe, and Si indicate that Fe impurities influence nanostructuring. The effect of inclined ion incidence shows an overlay between orientation-dependent and process geometry-related structure formation.
Ion beam finishing techniques are commonly used for improvement of surface error topography of optical devices. Optical aluminum surfaces after manufacturing by single-point diamond turning meet the requirements for applications in the infrared spectral range. However, optics used for applications in the short-wavelength visible and ultraviolet spectral range demand improved surface qualities. To overcome the limitations mainly caused by structural and compositional inhomogeneities of aluminum alloys, a reactive ion beam machining process using oxygen and nitrogen operating gas is applied. This technology enables direct surface machining while preserving the initial roughness up to a 1-μm etching depth using low-energy ion beams. Moreover, the use of oxygen allows us to smooth the surface in the microroughness regime. Based on Monte-Carlo simulations and roughness evolution measured by atomic force microscopy, a more detailed discussion of the ion beam process is presented. Hence, a model scheme for direct smoothing of high-frequency surface features is suggested.
For fabrication of high-performance mirror devices, technical aluminum alloys Al6061 or Al905 are widely used. The surface error topography after manufacturing by single-point diamond turning is applicable in the infrared spectral range. For increasing demands on the optical surface quality in the shortwave visible and ultraviolet spectral range, further improvement of the surface roughness is required. Hence, a promising alternative process to attain the required surface quality is evaluated. Within the ion beam planarization technique, a photoresist layer is deposited by conventional spin coating or spray coating technologies exhibiting an ultrasmooth surface. When removing the resist by reactive ion beam etch (RIBE) processing using nitrogen process gas, the ultrasmooth surface topography of the resist is transferred into the substrate. We optimized the photoresist thermal pretreatment to realize roughness preservation and a steady-state material removal rate during RIBE machining. The optimum preparation steps are explored based on roughness evaluation, chemical modification, and etch resistance of the negative photoresist. Reactive ion beam etching-based planarization is conducted on single-point diamond turned RSA Al905 and RSA Al6061 samples made of rapidly solidified aluminum (RSA) in a two-step process. The optimum process and the roughness evaluation are explored by topographic analysis applying a combination of white light interferometry and atomic force microscopy measurements.
Reflection losses due to refractive index mismatch limit the obtainable diffraction efficiencies for transmission gratings in the highly dispersive regime, i.e., with period to wavelength ratios smaller than 0.7. The design and fabrication of such gratings with high-diffraction efficiencies (≥94 % , Littrow configuration) will be discussed with an emphasis on process strategies to control the profiles in the reactive ion beam etching step. Experimental results from the manufacturing of monolithic fused silica pulse compression gratings with 3000 L / mm optimized for a center wavelength of 519 nm will be presented. The influence of different etching parameters such as etch gas mixture, ion incidence angle, and acceleration voltage of the ion source on profile depth, side-wall angle, duty cycle, and ultimately diffraction efficiencies will be discussed.
Ultraprecise mirror devices show considerable potential with view to applications in the visible and the ultraviolet spectral ranges. Aluminum alloys gather good mechanical and excellent optical properties and thus they emerge as important mirror construction materials. However, ultraprecision machining and polishing of optical aluminum surfaces are challenging, which originates from the high chemical reactivity and the heterogeneous matrix structure. Recently, several ion beam-based techniques have been developed to qualify aluminum mirrors for short-wavelength applications. We give an overview of the state-of-the-art ion beam-processing techniques for figure error correction and planarization, either by direct aluminum machining or with the aid of polymer or inorganic, amorphous surface films.
The surface error topography of optical aluminium surfaces after common manufacturing by single-point diamond turning meets the requirements for applications in the infrared spectral range. However, for short-wavelength applications in the (E)UV spectral range the requirements in the optical surface quality increase immensely. Reactive ion beam etching (RIBE) is a promising process route, which allows direct surface machining rather than the use of a NiP coating. Lowenergy ion beams driven by a reactive process control permit a roughness preservation up to 1 μm etching depth. The effect of RIBE machining on roughness features is evaluated suggesting a model scheme for smoothing of high-frequency features.
Various approaches for the preparation of nanostructures with dimension on macroscopic areas are known. In contrast to cost-intensive top-down lithographic techniques, various bottom-up methods based on ion beam technologies to form large arrays of nanostructured surfaces are well established. In principle, it can be distinguished between two routes at the preparation of nanostructures by low-energy ion bombardment sputtering.
The destructive route is characterized that under certain conditions, given by the self-organization processes, the ion beam induced erosion process can lead to the formation of e.g. well-ordered Si nanostructures like dots or ripples on the surface. Using a constructive route, i.e. glancing angle deposition by ion beam sputtering, sculptured thin films consisting of various nanostructures of several shapes, such as inclined and vertical columns, screws, and spirals, were deposited on Si substrates. It will be shown that morphology, shape, and diameter of the structures are influenced and can thus be controlled by adjusting various deposition parameters, including substrate temperature and ratio of substrate rotational speed to film deposition rate.
Applying reactive ion beam etching (RIBE) processes at the Leibniz Institute of Surface Modification (IOM), several reference samples to be used in industry for calibrating of roughness testing equipment have been generated with the smoothest sample featuring 0.1 nm rms Sq. Subsequently these reference samples have been measured cross-site applying atomic force microscopy (AFM), white light interferometry (WLI), Nomarski1 microscopy (NM) and scatterometry (iTIRM2) determining the appropriate range of measurable rms surface roughness for each industrial measuring device.
Cost-efficient machining of dielectric surfaces with high-precision and low-roughness for industrial applications is still challenging if using laser-patterning processes. Laser induced back side wet etching (LIBWE) using UV laser pulses with liquid heavy metals or aromatic hydrocarbons as absorber allows the fabrication of well-defined, nm precise, free-form surfaces with low surface roughness, e.g., needed for optical applications. The copper-sulphatebased absorber CuSO4/K-Na-Tartrate/NaOH/formaldehyde in water is used for laser-induced deposition of copper. If this absorber can also be used as precursor for laser-induced ablation, promising industrial applications combining surface structuring and deposition within the same setup could be possible. The etching results applying a KrF excimer (248 nm, 25 ns) and a Nd:YAG (1064 nm, 20 ns) laser are compared. The topography of the etched surfaces were analyzed by scanning electron microscopy (SEM), white light interferometry (WLI) as well as laser scanning microscopy (LSM). The chemical composition of the irradiated surface was studied by energy-dispersive X-ray spectroscopy (EDX) and Fourier transform infrared spectroscopy (FT-IR). For the discussion of the etching mechanism the laser-induced heating was simulated with finite element method (FEM). The results indicate that the UV and IR radiation allows micro structuring of fused silica with the copper-based absorber where the etching process can be explained by the laser-induced formation of a copper-based absorber layer.
Atomic force microscopy (AFM) is usually the instrument of choice for the investigation of the surface roughness of thin films. Often a detailed image and roughness analysis is hindered by tip artifacts. Many of these artifacts arise from a spatial convolution or dilation of the actual tip and the shape of the surface features imaged. Therefore a careful tip evaluation and calibration is important for a reliable roughness evaluation. In this study about a process for the fabrication of self- assembled nanometer-sized surface structures using low- energy ion sputtering of semiconductor surfaces is reported. The dimension of these structures (typically between 10 and 100 nm), the distance between them and their shape can be tuned by the parameters of the sputter process. With the help of surfaces prepared by this way the influence of the actual AFM tip quality on the measured surface topography was evaluated. Furthermore, it is shown that the tip quality has a strong influence on the parameters extracted from first- and second-order statistics of the surface roughness. This applies particularly with regard to surfaces characterized by a low surface roughness (approximately 1 nm) as generally obtained by means of thin film technologies.
Ion beam figuring (IBF) using inert gas (e.g. Ar) and (Reactive) ion beam etching [(R)IBE] gain growing interest in precision optical surface processing, RIBE mainly for proportional transfer of 3D-resist masks structures in hard optical materials and IBF for finishing and nanometer precision surface figuring in high performance optics technology. Ion beam and plasma jet etching techniques related to different optical surface figuring requirements have been developed at IOM during the last decade. Some of these techniques have been proven to be mature for application in industrial production. The developmental work include material related process tuning with respect to enhance the processing speed and to improve surface roughness and waviness, further various processing algorithms related to different surface figure requirements and processing related equipment modification. Plasma jet assisted chemical etching is under development with respect to efficient machining techniques for precision asphere fabrication. The paper gives an overview of precision engineering techniques for optical surface processing focusing on the status of ion beam and plasma techniques. The status of the proportional transfer of 3D micro-optical resist structures (e.g. micro-lens arrays, blazed fresnel lens structures) into hard optical and optoelectronic materials by (reactive) ion beam etching will be summarized.
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