Dr. David S. Alles Profile

Dr. David S. Alles

Vice President/Technology at KLA Corp

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Publications (4)

Proceedings Article | 9 November 2005 Paper

Measuring line-edge roughness of masks with DUV light

Stan Stokowski, David Alles

Proceedings Volume 5992, 59924P (2005) https://doi.org/10.1117/12.633184

KEYWORDS: Photomasks, Line edge roughness, Inspection, Deep ultraviolet, Spatial frequencies, Critical dimension metrology, Image analysis, Image processing, Semiconducting wafers, Lithography

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Proceedings Article | 20 August 2004 Paper

Results from a new die-to-database reticle inspection platform

William Broadbent, James Wiley, Zain Saidin, Sterling Watson, David Alles, Larry Zurbrick, Chris Mack

Proceedings Volume 5446, (2004) https://doi.org/10.1117/12.557784

KEYWORDS: Reticles, Inspection, Sensors, Lithography, Databases, Quartz, Image transmission, Defect detection, Deep ultraviolet, Image processing

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Proceedings Article | 17 December 2003 Paper

Results from a new reticle defect inspection platform

William Broadbent, James Wiley, Zain Saidin, Sterling Watson, David Alles, Larry Zurbrick, Chris Mack

Proceedings Volume 5256, (2003) https://doi.org/10.1117/12.518241

KEYWORDS: Reticles, Sensors, Inspection, Lithography, Defect detection, Image processing, Manufacturing, SRAF, Image transmission, Image resolution

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Proceedings Article | 19 July 2000 Paper

Reticle inspection system using DUV wavelength and new alogorithm platform for advanced reticle inspection for 0.13-um technology node

David Alles, Paul Terbeek, Shauh-Teh Juang, James Wiley, Kangmin Hsia

Proceedings Volume 4066, (2000) https://doi.org/10.1117/12.392087

KEYWORDS: Reticles, Inspection, Photomasks, Deep ultraviolet, Optical proximity correction, Computing systems, Databases, Imaging systems, Manufacturing, Double positive medium

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KLA-Tencor has developed a fourth-generation reticle inspection system, the KLA-Tencor 570, using DUV imaging to detect 100-nm defects on advanced OPC and PSM reticles for the 0.13 micron technology node production and 0.10 micron technology development. This system contains innovations in optics, electronics, mechanics, algorithms, and software. The DUV wavelength of the optical system improves the resolution and thus the minimum linewidth capability. A low- noise optical system generates high-quality images to improve productivity, facilitate defect classification, and reduce operator errors. The United Inspection Computer (UIC), a high-speed scalable computational engine, renders database data to create an image of the mask for die-to- database inspections. The UIC uses the new Ultra-Performance Algorithm, which provides high detection sensitivity at high speed for D:D and D:DB inspections. UPA can handle complex structures such as advanced OPC and phase shift mask. TI places no fundamental requirement on the size of OPC features. UPA classified defects automatically. The operator can select sensitivity settings independently for each defect type. Since UPA measures the CD of every feature on the reticle, it can also make total plate quality measurements for statistical process control of mask manufacturing. A new reticle handling system reduces overhead time and allows easy loading and unloading of the reticle. This system manipulates 6-inch and 230-mm reticles with and without pellicles. A flexible adapter design allows the system to mix different reticle sizes. A new data preparation system executes on a multi-processor computer with a 64-bit operating system to minimize data preparation time. This DPS architecture allows the operator to change various inspection parameters such as pixel size, alignment points, DNIR's and rotation without the need for re-prep, thereby improving productivity and flexibility. The KLA- Tencor 570 also allows optional remote Data Prep. Test results indicate that the KLA-Tencor 570 already meets its sensitivity specifications on a Verimask VT 690 in both die- to-die and die-to-database modes.

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