Bottom-up patterning approaches are gaining traction as the trade-offs between resolution, throughput, and cost continually run into limitations for advanced semiconductor manufacturing technologies. With these constraints in mind, we have previously explored spin-on selective deposition of polymers over microscale features for ultimate use in ALD technologies. Two methods have previously been explored. The first approach considered a spin-on self-assembled monolayer (SAM) protecting either a metal or dielectric pre-pattern followed by a selective spin-on polymer coating. The second approach customized a synthetic fluorinated polymer tailoring the surface energies to the structures and sizes of interest in order to achieve selective deposition. In this work, pre-patterned copper and dielectric patterns are explored for selective deposition using pitch ranges from 128nm – 1000nm. A combination of spin-on SAMs along with custom synthesized polymers are studied. Atomic force microscopy (AFM) and transmission electron microscopy (TEM) are used to characterize final polymer coatings and the impact of polymer structure, solution concentration, and processing conditions will be discussed. Ultimately, it will be shown that the combination of both spin-on SAMs and custom synthesized polymers successfully results in selective deposition over nanometer scale patterns, increasing previous resolution by two orders of magnitude.
Selective deposition holds promise to simplify next-generation device fabrication and bring down economic cost. In this work, selectively depositing polymers on metal/dielectric patterns was achieved by spin dewetting, a phenomenon that refers to the dewetting of polymers during spin coating. Our strategy utilizes self-assembled monolayers (SAMs) to induce dewetting of polymers over some areas. Line patterns of Cu/SiO2 were investigated. A hydrophobic SAM, octyltrichlorosilane (OTS, Cl3Si–C8H17), was selectively formed on SiO2 in the presence of Cu to render SiO2 non-wettable. During a subsequent spin coating step, polymers dewet from OTS-functionalized SiO2 and coat Cu exclusively. The spin dewetting process is strongly dictated by the spin coating kinetics. A systematic study of the processing conditions revealed strong dependence of polymer film coverage on spin speed, solution concentration, polymer molecular weight, casting solvent, and SAM hydrophobicity.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.