Heat-activated self-healing is a desirable property of multi-functional composite materials, particularly if the components of the material itself can be used as a heating element. The heating capabilities and resultant temperature changes of such a composite are investigated in this paper, using finite element modeling and then experimental testing. The composite to be tested consists of thin-wire copper fibers, chosen for particular electromagnetic properties, and an epoxy matrix, which will later be replaced by a self-healing polymer matrix. Direct electrical current is passed through the wires and causes heat dissipation throughout the composite, a process known as resistive heating. For this particular composite, a temperature of 80°C is desired, because at this temperature the polymer can heal within a reasonable amount of time. Using finite element simulations and testing of an actual sample, it was found that resistive heating can achieve the desired temperature using electrical power inputs as low as 0.1 W per square cm of composite panel. The temperature results from the experiments agree with the results from the finite element simulations.
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