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Bill Graupp
at Siemens EDA
SPIE Involvement:
Author
Publications (2)
Proceedings Article | 15 March 2012 Paper
The complexity of fill at 28nm and beyond
Norma Rodriguez, Jie Yang, Bill Graupp, Jeff Wilson, Eugene Anikin
Proceedings Volume 8327, 83270Q (2012) https://doi.org/10.1117/12.916011
KEYWORDS: Electronic design automation, Etching, Metals, Resolution enhancement technologies, Design for manufacturing, Manufacturing, Lithography, Semiconductors, Multilayers, Photomasks
Proceedings Article | 21 March 2007 Paper
Litho aware method for circuit timing/power analysis through process
Proceedings Volume 6521, 65210O (2007) https://doi.org/10.1117/12.711723
KEYWORDS: Lithography, Oscillators, Semiconducting wafers, Transistors, Visualization, Design for manufacturing, Integrated circuit design, Silicon, Process modeling, Etching
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