Image placement (IP) and overlay error specifications in the International Technology Roadmap for
Semiconductors (ITRS) continue to get tighter with each successive technology node. One of the
significant contributors to IP error is the non-flatness of the reticle substrate. In this paper, we will discuss
in detail the effect of reticle substrate shape on the overlay performance in extreme ultraviolet (EUV) tools.
Substrate shape-induced overlay effects are important when multiple device levels are printed using EUV
lithography. We present an analysis of 20 blanks with different flatness specifications for overlay
signatures when used for printing multiple device levels. A comprehensive analysis of scanner correctable
and non-correctable errors for different substrate shapes will also be presented. Non-flatness specifications
for EUV blanks will be reviewed based on these reticle-matching results. We will discuss results from
flatness measurements and the effect on overlay budget due to mismatched substrates using several
substrates with different flatness specifications.
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