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29 November 2012 Single package directly modulated laser bidirectional optical subassembly using a modified mini-dual-in-line package for 10 Gbps passive optical networks
Jong Jin Lee, Jongdeog Kim, Seihyoung Lee
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Optical Engineering, Vol. 51, Issue 12, 120501 (November 2012). https://doi.org/10.1117/1.OE.51.12.120501
Abstract
A bidirectional optical subassembly comprised of a 2.5 Gbps distributed feedback (DFB) laser diode (LD) directly modulated laser transmitter and a 10 Gbps positive intrinsic negative photodiode receiver was developed for an optical network unit of a 10 Gbps passive optical network. Here, a low-cost mini-dual-in-line package was modified to contain whole components of a transmitter and receiver in a single space while satisfying the requirements of 10 Gbps micro-device package standards. The transmitter was fabricated to achieve high optical output power by placing a micro aspheric lens very close to the DFB LD and reducing the thermal resistance between an LD chip and heat sink to bring down the DFB LD chip temperature. As a result, the transmitter output power was 3.5 dB higher than a conventional transistor outline can BOSA due to a high optical coupling efficiency of more than 70% and a low thermal resistance for heat dissipation. The receiver sensitivity was - 21 dBm at a bit error rate of 10-3 and the sensitivity penalty of the receiver due to signal crosstalk was less than 0.3 dB.
© 2012 Society of Photo-Optical Instrumentation Engineers (SPIE) 0091-3286/2012/$25.00 © 2012 SPIE
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Jong Jin Lee, Jongdeog Kim, and Seihyoung Lee "Single package directly modulated laser bidirectional optical subassembly using a modified mini-dual-in-line package for 10 Gbps passive optical networks," Optical Engineering 51(12), 120501 (29 November 2012). https://doi.org/10.1117/1.OE.51.12.120501
Published: 29 November 2012
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KEYWORDS
Transmitters
Receivers
Modulation
Laser optics
Technetium
Laser sintering
Passive optical networks
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