Development of a soldering/inspection workcell for surface mount       devices

Alan J. Conneely; Aidan J.H. Flanagan; Paul Gerard Lowe; Thomas J. Glynn

doi:10.1117/12.186841

1 December 1994 Development of a soldering/inspection workcell for surface mount devices

Alan J. Conneely, Aidan J.H. Flanagan, Paul Gerard Lowe, Thomas J. Glynn

Author Affiliations +

Optical Engineering, Vol. 33, Issue 12, (December 1994). https://doi.org/10.1117/12.186841

Abstract

The small focused spot size and localized heating possible with laser soldering makes it an attractive alternative technique for bonding surface mount devices with small lead pitch onto a printed wiring board. Using a Nd:YAG laser, we have applied this technique to reflow soldering of a test device-a 224-pin quad ceramic chip (lead spacing 25 mil)-onto pretinned substrates. The soldering step was incorporated into a larger workcell, in which an Adept robot was used to place the component in position and also to scan the laser beam, delivered via a fiber, over the leads to be soldered. The mobile laser head was modified to accept a miniature CCD camera coupled to a Cognex vision system, which allowed coincident viewing of the soldering process and postsoldering inspection of the joints.

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Alan J. Conneely, Aidan J.H. Flanagan, Paul Gerard Lowe, and Thomas J. Glynn "Development of a soldering/inspection workcell for surface mount devices," Optical Engineering 33(12), (1 December 1994). https://doi.org/10.1117/12.186841

Published: 1 December 1994

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