Poster
22 November 2023 Next generation particle detection metrology tool for EUV pellicles and mask backside defectivity control
Hans Arts, Hendrik Ketelaars
Author Affiliations +
Conference Poster
Abstract
Opto-mechatronic systems are getting smaller and require higher accuracy. Improved surface particle cleanliness and defectivity control, preferably below the micrometer range, is required to keep performance and yield at the same level. To fill this need, the Fastmicro Product Scanner is developed to measure surface particle contamination levels directly on large product surfaces such as blank wafers, backside of wafers, reticles, pellicles (top & bottom), displays and other products. At Photomask Technology 2022 Fastmicro presented the applicability of the Product Scanner to measure high-end EUV pellicles, including its future roadmap. This manuscript describes tests and results of several (pellicle) measurements over the last year and the next generation Product Scanner with its improved capabilities like: - Improved sensitivity towards 200nm - Pellicle pinhole detection - Organic / non-organic particle detection
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hans Arts and Hendrik Ketelaars "Next generation particle detection metrology tool for EUV pellicles and mask backside defectivity control", Proc. SPIE PC12751, Photomask Technology 2023, PC1275112 (22 November 2023); https://doi.org/10.1117/12.3007936
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KEYWORDS
Pellicles

Particles

Extreme ultraviolet

Metrology

Scanners

Semiconducting wafers

Particle contamination

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