Lithography solutions enabling advanced packaging and heterogeneous integration applications

Doug Shelton; Hiromi Suda; Ken-Ichiro Mori; Ken-Ichiro Shinoda; Yoshio Goto; Kosuke Urushihara; Masaki Mizutani; Yusuke Tokuyama

doi:10.1117/12.2687747

22 November 2023 Lithography solutions enabling advanced packaging and heterogeneous integration applications

Doug Shelton, Hiromi Suda, Ken-Ichiro Mori, Ken-Ichiro Shinoda, Yoshio Goto, Kosuke Urushihara, Masaki Mizutani, Yusuke Tokuyama

Author Affiliations +

Proceedings Volume PC12751, Photomask Technology 2023; PC127510C (2023) https://doi.org/10.1117/12.2687747
Event: SPIE Photomask Technology + EUV Lithography, 2023, Monterey, California, United States

Abstract

Heterogeneous Integration is one “More-than-Moore” strategy that can help continue the trend towards overall electronics system scaling and cost reduction. Heterogeneous Integration involves high-efficiency and high-density interconnection of multiple chiplets and/or dies using advanced packaging technologies to provide communication bandwidth beyond what can be accomplished through circuit scaling alone. This paper introduces the FPA-5520iV and FPA-8000iW steppers that are designed to meet the requirements of sub-micron Heterogeneous Integration applications. Topics include warped substrate handling, panel substrate processing, die-by-die overlay of highly distorted substrates, high-fidelity imaging across large exposure fields and high-accuracy stitching for exposure fields larger than 1 reticle.

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Doug Shelton, Hiromi Suda, Ken-Ichiro Mori, Ken-Ichiro Shinoda, Yoshio Goto, Kosuke Urushihara, Masaki Mizutani, and Yusuke Tokuyama "Lithography solutions enabling advanced packaging and heterogeneous integration applications", Proc. SPIE PC12751, Photomask Technology 2023, PC127510C (22 November 2023); https://doi.org/10.1117/12.2687747

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