0.33 NA EUV systems for high-volume manufacturing

Christophe Smeets; Guido Salmaso; Joe Carbone; Marcel Mastenbroek; Nico Benders; Roderik Van Es

doi:10.1117/12.2644629

16 November 2022 0.33 NA EUV systems for high-volume manufacturing

Christophe Smeets, Guido Salmaso, Joe Carbone, Marcel Mastenbroek, Nico Benders, Roderik Van Es

Author Affiliations +

Proceedings Volume PC12292, International Conference on Extreme Ultraviolet Lithography 2022; PC1229202 (2022) https://doi.org/10.1117/12.2644629
Event: SPIE Photomask Technology + EUV Lithography, 2022, Monterey, California, United States

Abstract

ASML NXE:3400 and NXE:3600D scanners are now commonly used for High Volume Manufacturing (HVM) of 7nm to 3nm logic devices as well as 10nm class memory devices. In this paper we will share the latest performance of these systems, including excellent overlay, critical dimension (CD) control, stability, reliability, and high productivity. Furthermore, we will address the ASML roadmap for meeting the requirements for the 2 nm node and beyond.

Conference Presentation

Citation Download Citation

Christophe Smeets, Guido Salmaso, Joe Carbone, Marcel Mastenbroek, Nico Benders, and Roderik Van Es "0.33 NA EUV systems for high-volume manufacturing", Proc. SPIE PC12292, International Conference on Extreme Ultraviolet Lithography 2022, PC1229202 (16 November 2022); https://doi.org/10.1117/12.2644629

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