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The elimination of Polystyrene Latex Sphere (PSL) and Silica deposition on both filmed and bare Silicon wafers prior to SSIS recipe creation and ADC creates a challenge for light scattering surface intensity based defect binning. This study explored the theoretical maximal SSIS sensitivity based on native defect recipe creation in conjunction with the maximal sensitivity derived from BRDF modeling recipe creation. Single film and film stack wafers were inspected with recipes based upon BRDF modeling. Following SSIS recipe creation, initially targeting maximal sensitivity, selected recipes were optimized to classify defects commonly found on non-patterned wafers. The results were utilized to determine the ADC binning accuracy of the native defects and evaluate the SSIS recipe creation methodology. A statistically valid sample of defects from the final inspection results of each SSIS recipe and filmed substrate were reviewed post SSIS ADC processing on a Defect Review Scanning Electron Microscope (SEM). Native defect images were collected from each statistically valid defect bin category/size for SEM Review. The data collected from the Defect Review SEM was utilized to determine the statistical purity and accuracy of each SSIS defect classification bin. This paper explores both, commercial and technical, considerations of the elimination of PSL and Silica deposition as a precursor to SSIS recipe creation targeted towards ADC. Successful integration of SSIS ADC in conjunction with recipes created via BRDF modeling has the potential to dramatically reduce the workload requirements of a Defect Review SEM and save a significant amount of capital expenditure for 450mm SSIS recipe creation. |
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CITATIONS
Cited by 1 scholarly publication.
Scanning electron microscopy
Semiconducting wafers
Silica
Bidirectional reflectance transmission function
Light scattering
Air contamination
Inspection
