Paper
27 February 2015 Heterogenous integration: the more-than-Moore path to silicon photonic microsystems
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Abstract
Aurion's heterogeneous integration platform combines best-in-class passive and active devices in a cost-effective manufacturing process for both military and commercial systems. The resulting silicon photonics chips can be intimately integrated with advanced electronics to enable new system-in-package capability.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gregory Fish and Alexander Fang "Heterogenous integration: the more-than-Moore path to silicon photonic microsystems", Proc. SPIE 9366, Smart Photonic and Optoelectronic Integrated Circuits XVII, 93660H (27 February 2015); https://doi.org/10.1117/12.2084856
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KEYWORDS
Silicon photonics

Semiconducting wafers

Photonic integrated circuits

Silicon

Packaging

Manufacturing

Semiconductor lasers

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