High speed micromachining with high power UV laser

Rajesh S. Patel; James M. Bovatsek

doi:10.1117/12.2008698

15 March 2013 High speed micromachining with high power UV laser

Rajesh S. Patel, James M. Bovatsek

Proceedings Volume 8608, Laser-based Micro- and Nanopackaging and Assembly VII; 86080A (2013) https://doi.org/10.1117/12.2008698
Event: SPIE LASE, 2013, San Francisco, California, United States

Abstract

Increasing demand for creating fine features with high accuracy in manufacturing of electronic mobile devices has fueled growth for lasers in manufacturing. High power, high repetition rate ultraviolet (UV) lasers provide an opportunity to implement a cost effective high quality, high throughput micromachining process in a 24/7 manufacturing environment. The energy available per pulse and the pulse repetition frequency (PRF) of diode pumped solid state (DPSS) nanosecond UV lasers have increased steadily over the years. Efficient use of the available energy from a laser is important to generate accurate fine features at a high speed with high quality. To achieve maximum material removal and minimal thermal damage for any laser micromachining application, use of the optimal process parameters including energy density or fluence (J/cm²), pulse width, and repetition rate is important. In this study we present a new high power, high PRF QuasarR 355-40 laser from Spectra-Physics with TimeShift^TM technology for unique software adjustable pulse width, pulse splitting, and pulse shaping capabilities. The benefits of these features for micromachining include improved throughput and quality. Specific example and results of silicon scribing are described to demonstrate the processing benefits of the Quasar’s available power, PRF, and TimeShift technology.

Citation Download Citation

Rajesh S. Patel and James M. Bovatsek "High speed micromachining with high power UV laser", Proc. SPIE 8608, Laser-based Micro- and Nanopackaging and Assembly VII, 86080A (15 March 2013); https://doi.org/10.1117/12.2008698

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