Paper
1 January 1987 Overlapping-Gate Ccd Imagers On Gallium Arsenide
P. B. Kosel, D. S. Katzer, R. E . Poore
Author Affiliations +
Proceedings Volume 0836, Optoelectronic Materials, Devices, Packaging, and Interconnects; (1987) https://doi.org/10.1117/12.967518
Event: Cambridge Symposium on Fiber Optics and Integrated Optoelectronics, 1987, Cambridge, MA, United States
Abstract
Charge-coupled device (CCD) imagers have been fabricated on gallium arsenide (GaAs) with very closely spaced (<100nm) Schottky-barrier metal electrodes. The short interelectrode spacing was achieved by using anodic oxidation in an ethylene glycol based electrolyte. All the active device regions of the CCD imagers were formed by silicon implantation into semi-insulating GaAs substrates followed by rapid thermal activation. The photodetectors were Schottky barrier diodes formed with thin aluminum metal anodes over silicon-implanted active regions in the semi-insulating substrate. The detectors formed a linear array along one side of the CCD channel and a three-phase transfer electrode structure was used. The imagers have been tested with front side illumination at clocking speeds up to 25 MHz.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
P. B. Kosel, D. S. Katzer, and R. E . Poore "Overlapping-Gate Ccd Imagers On Gallium Arsenide", Proc. SPIE 0836, Optoelectronic Materials, Devices, Packaging, and Interconnects, (1 January 1987); https://doi.org/10.1117/12.967518
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KEYWORDS
Charge-coupled devices

Silicon

Electrodes

Gallium arsenide

Imaging systems

Oxides

Metals

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