Paper
22 April 1987 Invited Paper Recent Developments In Reactive Plasma Etching Of III-V Compound Semiconductors
Evelyn L. Hu, Larry A. Coldren
Author Affiliations +
Proceedings Volume 0797, Advanced Processing of Semiconductor Devices; (1987) https://doi.org/10.1117/12.941031
Event: Advances in Semiconductors and Semiconductor Structures, 1987, Bay Point, FL, United States
Abstract
Reactive plasma etching is being increasingly utilized in the fabrication of III-V - based electronic and optoelectronic devices. The high resolution and control afforded by dry etching processes have led to their rapid move from research to manufacturing applications. This paper will review some of those applications, processes, progress and problems associated with reactive plasma etching of III-V materials.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Evelyn L. Hu and Larry A. Coldren "Invited Paper Recent Developments In Reactive Plasma Etching Of III-V Compound Semiconductors", Proc. SPIE 0797, Advanced Processing of Semiconductor Devices, (22 April 1987); https://doi.org/10.1117/12.941031
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Cited by 5 scholarly publications.
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KEYWORDS
Etching

Gallium arsenide

Plasma etching

Aluminum

Heterojunctions

Reactive ion etching

Plasma

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