Glass-encapsulant interface characterization following temperature and humidity exposure

Katherine Stika; Rebecca Smith; Dennis Swartzfager; Donald Huang; Diane Davidson; James Marsh; Robert Agostinelli; John Wyre; Donald Brill; Roger Senigo

doi:10.1117/12.860865

19 August 2010 Glass-encapsulant interface characterization following temperature and humidity exposure

Katherine Stika, Rebecca Smith, Dennis Swartzfager, Donald Huang, Diane Davidson, James Marsh, Robert Agostinelli, John Wyre, Donald Brill, Roger Senigo

Author Affiliations +

Proceedings Volume 7773, Reliability of Photovoltaic Cells, Modules, Components, and Systems III; 777311 (2010) https://doi.org/10.1117/12.860865
Event: SPIE Solar Energy + Technology, 2010, San Diego, California, United States

Abstract

The ability to optimize and consistently control the properties of the polymer-glass interface in thin film PV laminates in an important aspect of module reliability. Using variable rate peel delamination methods developed to isolate the encapsulant/glass interface, ion migration and interfacial chemistry have been studied following temperature and humidity exposure. In this presentation we will review quantitative AFM (Atomic Force Microscopy) and XPS (X-ray Photoelectron Spectroscopy) analyses linking failure modes with interfacial chemistry.

Citation Download Citation

Katherine Stika, Rebecca Smith, Dennis Swartzfager, Donald Huang, Diane Davidson, James Marsh, Robert Agostinelli, John Wyre, Donald Brill, and Roger Senigo "Glass-encapsulant interface characterization following temperature and humidity exposure", Proc. SPIE 7773, Reliability of Photovoltaic Cells, Modules, Components, and Systems III, 777311 (19 August 2010); https://doi.org/10.1117/12.860865

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