Paper
24 August 2009 Modeling of wet adhesion of microstructures in shock environment
Zhen-Zhong Wang, Qing-An Huang, Jie-Ying Tang
Author Affiliations +
Proceedings Volume 7381, International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors; 73812S (2009) https://doi.org/10.1117/12.835690
Event: International Symposium on Photoelectronic Detection and Imaging 2009, 2009, Beijing, China
Abstract
Adhesion, as one of the most common failure modes compromising reliability of optical MEMS devices, attracted great research interests for enhancing the production yields and device reliability. Experiments show that wet-adhesion with respect to capillary force between interfaces of movable structures is generally the dominant figure among all adhesion natures. Great efforts had been made on examine adhered length of micro-cantilevers to modeling adhesion energy, which are reasonable to predict adhesion in quasi static process such as sacrificial layer release processes. However, the microcosmic mechanism of adhesion has not been well revealed, thereby these models are not sufficiently precise for in-situ adhesion, such as adhesion due to mechanical shock. In this work, a novel model of adhesion energy is derived by review the physical mechanisms carefully and shock caused adhesion is studied applying this model.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Zhen-Zhong Wang, Qing-An Huang, and Jie-Ying Tang "Modeling of wet adhesion of microstructures in shock environment", Proc. SPIE 7381, International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors, 73812S (24 August 2009); https://doi.org/10.1117/12.835690
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KEYWORDS
Reliability

Failure analysis

Capillaries

Microelectromechanical systems

Microopto electromechanical systems

Humidity

Instrument modeling

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