Paper
2 February 2009 Experimental study of roof filling rate during thermal bonding of polymer microchannel sealing
Xudi Wang, Jingjing Lu, Yun Jiang, Liangjin Ge, Shaojun Fu
Author Affiliations +
Abstract
Direct thermal bonding approaches are especially desirable as they allow formation of enclosed microchannels with uniform surfaces composed entirely of the same polymeric material. It is often believed that the main phenomenon involved during thermal bonding is a chain entanglement of the polymers over the boundary. If the temperature is too high and/or the application of the force is too long then the polymer will flow and refill the channels caused by capillary forces, called as roof filling phenomenon. In order to understand this process more fully, we describe an experimental method for characterizing the roof filling rate inside a microchannel by measuring the polymer marching velocity or position of a capillary meniscus during thermal bonding. 1D nanochannels was fabricated succesfully and the vertical dimension was well controlled according to the top filling mechnism.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xudi Wang, Jingjing Lu, Yun Jiang, Liangjin Ge, and Shaojun Fu "Experimental study of roof filling rate during thermal bonding of polymer microchannel sealing", Proc. SPIE 7159, 2008 International Conference on Optical Instruments and Technology: MEMS/NEMS Technology and Applications, 71590M (2 February 2009); https://doi.org/10.1117/12.807059
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KEYWORDS
Polymers

Capillaries

Microfluidics

Scanning electron microscopy

Glasses

Interfaces

Nanolithography

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