Paper
26 March 2008 Development of new BARC for immersion process using hyper NA
Author Affiliations +
Abstract
Most semiconductor companies are using Bottom Anti-Reflective Coating (BARC) on their lithography process to reduce bottom reflectivity, which is cause of standing wave, pattern collapse, and bad pattern profile, and to improve lithographic performance. BARC has been diversified to adapt to the wavelength of exposure light and refractive indices of photoresists and substrates. Recently, many semiconductor companies introduce new process, such as immersion process and double patterning process, to get high resolution for next generation semiconductor and they are trying to apply these processes to their mass production. Among those process solutions, a strong candidate for high resolution is introduction of hyper NA(Numerical Aperture) exposure tool, using immersion process. There is one thing to solve for BARC material when immersion process is applied. It is reflectivity. As NA of exposure tool increases, reflectivity from a substrate also increases, simultaneously. We simulated the difference of reflectivity with increasing NA and we found a proper way how to control reflectivity on immersion process with refractive indices of BARC. We will report simulation data for immersion process and introduce our new developed BARC for hyper NA process in this paper.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hyo Jung Roh, Man Ho Han, Sang Jeoung Kim, Hyun Jin Kim, Jaehyun Kim, Keun Kyu Kong, Ki Lyoung Lee, Sung Koo Lee, and Dong Heok Park "Development of new BARC for immersion process using hyper NA", Proc. SPIE 6923, Advances in Resist Materials and Processing Technology XXV, 69232T (26 March 2008); https://doi.org/10.1117/12.776801
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Reflectivity

Etching

Refractive index

Photoresist processing

Semiconductors

Polymers

Lithography

Back to Top