Paper
27 March 2007 Challenges and solutions for transferring a 248-nm process to 365-nm imaging
Alexander Serebriakov, Chicheng Chang, Arthur Becht, Rene Pluijms, Anthony Cheng, Elly Shi, Han van den Broek, Li Zhao
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Abstract
In order to minimize manufacturing costs, lithographers have to extend the capabilities of KrF and i-line tools working with low k1 factor. In this paper we present results of a successful transfer of several lithographic processes from KrF to i-line. During the process transfer, the optimal conditions for 365-nm technology were first determined by simulation and then verified by exposure of real production layers on a 0.65 NA i-line tool. The goal of the process optimization was to find settings for 365-nm process, which can match the performance of the 248-nm process. Proximity matching, CD uniformity, tool throughput and process costs were chosen as the main criteria for successful transfer. Encountered challenges, the applied methodology and the experimental results have been discussed. Based on the results, we conclude that low k1 i-line lithography is feasible for mass production with CD as small as 210 nm. The process does not require additional preparation for 248-nm masks.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alexander Serebriakov, Chicheng Chang, Arthur Becht, Rene Pluijms, Anthony Cheng, Elly Shi, Han van den Broek, and Li Zhao "Challenges and solutions for transferring a 248-nm process to 365-nm imaging", Proc. SPIE 6520, Optical Microlithography XX, 65204L (27 March 2007); https://doi.org/10.1117/12.710856
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KEYWORDS
Lithography

Electroluminescence

Metals

Critical dimension metrology

Image processing

Manufacturing

Photoresist processing

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