Photomasks with various sub resolution assist feature (SRAF) were vigorously cleaned by a megasonic tool, and their
pattern damage, "SRAF-missing", was investigated. As a result, it was found that SRAF-missing can occur at a low
probability by the megasonic cleaning and the probability significantly depends on SRAF size, especially width. With
smaller than 100 nm width, SRAF-missing probability rapidly increased with SRAF width reduction. In addition, the
relationship between SRAF-missing and acoustic pressure was investigated, and at the same time that between particle
removal efficiency (PRE) and acoustic pressure was also investigated. As a result, SRAF-missing and PRE showed a
trade-off relationship. Using all results, an experimental equation was provided. After verification by additional
experiments, some simulations were done, and megasonic cleaning subject was predicted for the 45nm and 32nm-node
mask fabrication.
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