Through-process modeling in a DfM environment

Scott Mansfield; Geng Han; Mohamed Al-Imam; Rami Fathy

doi:10.1117/12.658049

14 March 2006 Through-process modeling in a DfM environment

Scott Mansfield, Geng Han, Mohamed Al-Imam, Rami Fathy

Proceedings Volume 6156, Design and Process Integration for Microelectronic Manufacturing IV; 615603 (2006) https://doi.org/10.1117/12.658049
Event: SPIE 31st International Symposium on Advanced Lithography, 2006, San Jose, California, United States

Abstract

In recent years, design for manufacturability (DfM) has become an important focus item of the semiconductor industry and many new DfM applications have arisen. Most of these applications rely heavily on the ability to model process sensitivity and here we explore the role of through-process modeling on DfM applications. Several different DfM applications are examined and their lithography model requirements analyzed. The complexities of creating through-process models are then explored and methods to ensure their accuracy presented.

Citation Download Citation

Scott Mansfield, Geng Han, Mohamed Al-Imam, and Rami Fathy "Through-process modeling in a DfM environment", Proc. SPIE 6156, Design and Process Integration for Microelectronic Manufacturing IV, 615603 (14 March 2006); https://doi.org/10.1117/12.658049

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